Manufacture method for soft and hard composite board
A soft-hard composite board and a manufacturing method technology, applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as reduced production rate, difficulty in accurately controlling cutting depth, time and money waste, etc.
Inactive Publication Date: 2009-11-18
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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Problems solved by technology
[0004] However, the method of removing redundant hard boards by using mechanical contour processing technology, especially when cutting a hard board with a predetermined depth at the junction of soft and hard boards, has the difficulty of accurately controlling the cutting depth and the risk of damage to the soft board , and most of the appearance processing technologies that remove the process require the use of more expensive jigs or tools, resulting in a substantial increase in costs during small-scale and diverse production. In addition, the design and production of jigs or molds will cause time and money loss, resulting in The production rate is reduced and the total cost is increased. Therefore, this technical field still needs an improved manufacturing process of soft and rigid composite boards to improve the shortcomings of the prior art.
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[0027] In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, preferred embodiments are enumerated below and described in detail with accompanying drawings. However, the following preferred embodiments and drawings are only for reference and description, and are not intended to limit the present invention.
[0028] see Figure 1 to Figure 7 , which is a schematic diagram of a method for manufacturing a rigid-flex composite board according to a preferred embodiment of the present invention.
[0029] like figure 1 As shown, firstly, a flexible board 10 is provided, which includes an intermediate base layer 12 , a copper circuit pattern layer 22 and a copper circuit pattern layer 32 . Wherein, the intermediate matrix layer 12 can be made of a dielectric material, and the material of the dielectric material can be polyimide resin, polyester or liquid crystal polymer, etc., but not limited thereto.
[0030] Next, cover...
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The invention provides an improved manufacturing method of the soft-rigid composite board, especially a method for improving the removal method of the redundant hard board directly above the predetermined bending area of the soft board. The main feature of the present invention is that after the completion of each layer of hard board circuit, a groove is etched at the junction of the hard board and the predetermined soft board bending area by laser, and then mechanically formed, and then etched away by copper etching method. The copper foil layer at the bottom, and finally remove the excess rigid board directly above the intended soft board bend area.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a rigid-flex circuit board. Background technique [0002] Rigid-flex circuit boards (hereinafter referred to as rigid-flex composite boards) have been widely used in mobile phone communications, medical treatment, industrial instruments and consumer electronics products due to their flexible properties. [0003] As known to those familiar with this technology, the production of flexible and rigid composite boards usually starts with a flexible circuit board (hereinafter referred to as the soft board) as the core, and then uses the rigid multilayer circuit board (hereinafter referred to as the rigid board) process, such as The build-up method, or in the form of core lamination, forms one or more layers of circuits on the flexible board. Finally, it is necessary to remove the redundant hard board above the predetermined bending area of t...
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IPC IPC(8): H05K3/00
Inventor 蔡宗委林宇伦许宏恩
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION