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Method for forming reflection cover and its structure and bearing device using the same

A technology of carrying device and reflective cover, which is applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problems of difficult shaping of the reflective cover.

Inactive Publication Date: 2009-12-09
ELIT FINE CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, the main purpose of the present invention is to form a metal layer on the green body structure by thick film printing, especially printing a reflective silver layer, which can replace the conventional coating technology and can improve the light extraction efficiency of light-emitting diodes, and utilize The pressing method of hot pressing is applied to the reflective cover mainly made of ceramic green embryos, which can make the hole shape and angle of the reflective cover required by the light-shape design of the light-emitting diode, and solve the problem that the shape of the ceramic reflective cover is not easy

Method used

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  • Method for forming reflection cover and its structure and bearing device using the same
  • Method for forming reflection cover and its structure and bearing device using the same
  • Method for forming reflection cover and its structure and bearing device using the same

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Embodiment Construction

[0040] In order to make the composition and implementation of the present invention clear to your examiner, the description is as follows in conjunction with the drawings:

[0041] The method for forming the light-emitting diode reflective cover and its structure of the present invention, as well as the light-emitting diode carrying device using the reflective cover, and the method for forming the light-emitting diode can be as follows figure 1 As shown, its step 1: first provide at least one first green embryo structure, wherein the first green embryo structure has a first opening pattern; Step 2: provide a second green embryo structure, the second green embryo structure has a The second opening pattern, the opening ratio of the second opening pattern is smaller than the opening ratio of the first opening pattern, and is arranged on the first green structure, so that the first and second opening patterns overlap up and down Positional relationship; step 3: setting a metal lay...

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Abstract

The invention relates to a light emitting diode reflection cover forming method and a structure thereof, which provide a first briquette structure and a second briquette structure, wherein, the first briquette structure and the second briquette structure are respectively provided with a first cut-out pattern and a second cut-out pattern. The cut-out rate of the second cut-out pattern is smaller than that of the first cut-out pattern. The second briquette structure is arranged on the first briquette structure such that the first cut-out pattern and second cut-out pattern have an overlapping position relation up and down, and the second briquette structure is coated with a metal layer. The second briquette structure is molded and covered on the first briquette structure along the cut-out pattern of the first briquette structure so that the metal layer is the hole wall of the reflection cover hole.

Description

technical field [0001] The present invention relates to a method for forming a light-emitting diode reflective cover and its structure, and a light-emitting diode carrying device using the reflective cover, especially a method for shaping a ceramic reflective cover of a light-emitting diode, and can select the bearing angle of the light-emitting diode carrying device . Background technique [0002] Because light-emitting diodes have the characteristics of small size, low power consumption, low heat and long life, such as Christmas lights, flashlights, vehicle signal lights, traffic signs and other commodities, light-emitting diodes have gradually been used to replace traditional tungsten bulbs with similar functions; Also, the basic structure of a general light-emitting diode is that conductive ends of different polarities and a carrying portion are provided inside a transparent package, a chip is provided at the carrying portion, and gold wires are provided to form the elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L21/48H01L23/498C04B41/88
CPCH01L2924/0002H01L2224/48091
Inventor 张正兴谢荣修陈国湖李敏丽
Owner ELIT FINE CERAMICS
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