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Semi-aromatic polyamides with low moisture regain

An aliphatic polyamide, low moisture technology, applied in the field of polyamide, soft semi-aromatic polyamide

Active Publication Date: 2009-12-23
ATOFINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

None of these prior art discloses possible trends in aging
Furthermore, none of these prior art discloses the need for soft polyamides

Method used

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  • Semi-aromatic polyamides with low moisture regain

Examples

Experimental program
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preparation example Construction

[0090] For the preparation of the compositions of the invention, any conventional method of polyamide and copolyamide synthesis can be used.

[0091] The composition according to the invention may additionally comprise at least one additive selected from:

[0092] -dye;

[0093] -pigment;

[0094] - brighteners;

[0095] - antioxidants;

[0096] - flame retardants;

[0097] - UV stabilizers;

[0098] -Nucleating agent.

[0099] The invention also relates to structures comprising at least one layer consisting of the above composition.

[0100] The following types of structures are within the scope of the invention (described from the outermost layer of the object to the inner layer):

[0101] Structure Type 1

[0102] Outer layer composed of aliphatic polyamide or polyolefin or compatibilized blends of the two as described below

[0103] optional adhesive layer

[0104] An inner layer consisting of a composition of the invention.

[0105] Structure Type 2

[0106...

Embodiment 1

[0179] Example 1: Preparation of 11 / 10 by mole, T: 0.7 / 1.1

[0180] 12.2kg of terephthalic acid, 12.65kg of decanediamine, 10.15kg of 11-aminoundecanoic acid, 10 liters of water, 175g of stearic acid as a chain limiter, and 1.4g of Silikonol 1000 as an antifoaming agent were added to 100 liter reactor.

[0181] The mixture was heated to 150° C. and kept at 5 bar for 2 hours. It was then heated to 270°C while reducing the pressure enough to reach 270°C, 20 bar.

[0182] The pressure was reduced to atmospheric pressure within 2 hours and the polymerization was carried out within 45 minutes while flushing with nitrogen.

[0183] The intrinsic viscosity in m-cresol is 1.27 dl / g. The MFI at 275°C and at 2.16 kg is 3.0 g / 10 min.

[0184] DSC (ISO 11357 standard at 20°C / min) gave two melting peaks at 243°C and 259°C on the second heat.

[0185] In DMA, tan δ is about 100°C under dry conditions.

[0186] Operating conditions:

[0187] ●Device: RSA2 Tension

[0188] ●Temper...

Embodiment 2

[0196] Embodiment 2: Preparation with mole 10, 10 / 10, T: 0.7 / 1.1

[0197] 10.24 kg terephthalic acid, 18.05 kg decanediamine, 8.71 kg sebacic acid, 10 liters of water, 185 g of stearic acid as a chain limiter, and 1.5 g of Silikonol 1000 as an antifoaming agent were added to a 100 liter reactor .

[0198] The mixture was heated to 150° C. and kept at 4.5 bar for 2 hours. It was then heated to 280°C while reducing the pressure enough to reach 280°C, 20 bar.

[0199] The pressure was reduced to atmospheric pressure within 2 hours and the polymerization was carried out within 60 minutes while flushing with nitrogen.

[0200] The intrinsic viscosity in m-cresol is 1.25 dl / g. The MFI at 275°C and at 2.16 kg is 5 g / 10 min.

[0201] DSC gave two melting peaks at 240 and 255°C.

[0202] In DMA, the tan δ is 85°C on a 80*10*4 test piece under dry conditions.

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Abstract

The present invention relates to a composition comprising, by weight, a total of 100:-60-99.5% (preferably 70-93%) at least one copolyamide of the general formula X / Y, Ar, wherein: Y represents The residue of an aliphatic diamine containing 8-20 carbon atoms, Ar represents the residue of an aromatic dicarboxylic acid, X represents aminoundecanoic acid NH 2 -(CH 2 ) 10 -COOH, lactam-12 or the residue of the corresponding amino acid, or X represents a unit Y, x, residue, or X derived from the condensation of a diamine with an aliphatic dibasic acid (x) containing 8-20 carbon atoms Denotes the residue of units Y, I, from the condensation of diamines with isophthalic acid, -0.5-40% (preferably 7-30%) of at least one product selected from the group consisting of plasticizers, nanofillers, polyolefins , cross-linked polyolefins and additives.

Description

technical field [0001] The present invention relates to soft semiaromatic polyamides with low moisture absorption. These polyamides also have good elongation properties. These polyamides have high thermomechanical strength. Polyamide-6 and polyamide-6,6 have high melting points, but their conversion is difficult and, moreover, their water absorption is too high, which impairs their mechanical properties and their aging resistance. Additionally, they are too rigid to be used as pipes, and then plasticizers or impact modifiers must be employed to make them flexible. Then all performance is lost. Due to their outstanding mechanical properties, their ease of use and their aging resistance, polyamide-12 and polyamide-11 are more used in the automotive industry. However, their thermomechanical strength is insufficient above a processing temperature of 160°C. The present invention relates to polyamides intended to replace polyamide-12 and polyamide-11, but having improved thermo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08G69/26H01B1/12C08G69/12B32B1/00B32B27/34C08G69/02C08G69/36C08G73/02C08L23/02C08L51/06C08L77/00C08L77/10H01B3/30
CPCB32B27/34H01B3/305C08L51/06C08L77/06C08G69/36C08L77/00C08L23/02C08L2666/06C08L51/00C08G69/12C08L77/10C08G73/02B82Y30/00B32B27/08B32B27/32
Inventor 菲利普·布朗德尔蒂里·布里福德安尼特·莱恩曼海伦·埃格雷特皮埃尔·诺格斯
Owner ATOFINA