LED back light module
A backlight module and LED chip technology, applied in optics, nonlinear optics, instruments, etc., can solve the problems of heat dissipation, unfavorable heat, and unfavorable production of backlight modules, etc.
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Embodiment 1
[0020] Such as figure 1 As shown, in this embodiment, the structure for accommodating the LED chip 11 is the light guide plate 2. figure 1 It is a schematic diagram of placing a single LED chip 11 in the concave structure 21 of the light guide plate 2. The single blue LED chip 11 used in this example is placed on the chip base 12, and its electrode is connected to the substrate with a circuit through the LED electrode lead 13. The chip base 12 is made of materials with high thermal conductivity and good mechanical properties. These materials may be silicon or metal. The substrate adopts a metal base PCB board with good heat dissipation effect, and its structure includes a substrate metal layer 31, a substrate insulation layer 32, and a substrate heat dissipation layer 33. The main body of the light guide plate 2 is made of acrylic material, and a concave structure 21 for accommodating LED chips is made on the light guide plate. The concave structure 21 can be made by injection m...
Embodiment 2
[0024] Such as figure 2 At this time, in this embodiment, the structure 2 accommodating the LED chip 11 is a light guide plate. figure 2 It is a schematic diagram of placing a plurality of LED chips 11 in the concave structure 21 of the light guide plate 2. Three monochromatic LED chips 11 of red, green and blue are placed on the chip base 12, and their electrodes are connected to the circuit board substrate via LED electrode lead-out leads 13. The chip base 12 is made of materials with high thermal conductivity and good mechanical properties. These materials may be silicon or metal. The circuit substrate adopts a metal-based PCB board with good heat dissipation effect, and its structure includes a substrate metal layer 31, a substrate insulating layer 32, and a substrate gate thermal layer 33. The main body of the light guide plate 2 is made of acrylic material, and a concave structure 21 for accommodating LED chips is made on the light guide plate. The concave structure 21 can...
Embodiment 3
[0027] In this embodiment, the structure for accommodating the LED chip 11 is the light diffusing plate 3, and the LED chip 11 is packaged in the light diffusing plate 3 in a flip-chip form. The electrodes of the LED chip 11 are connected to the chip base 12 through solder metal bumps 14. The solder metal bumps 14 can be Pb / Sn alloys and Au / Sn alloys made by electroplating methods, or metal Au bumps can be directly used, and the flip chip form can be used to greatly improve the heat dissipation efficiency. It can be known from the known technology that light is emitted from the bottom of the LED chip 11 to have better light extraction efficiency.
[0028] Using a structure similar to that of the first embodiment, a similar Figure 4 with Figure 5 The edge-lit and direct-lit backlight modules shown.
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