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Lead-free solder alloy

A lead-free solder alloy and alloy technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve problems such as poor quality, easy damage to the desired performance of tin-lead alloy, alloy doping, etc.

Active Publication Date: 2010-01-06
METALLIC RESOURCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thus, in the past, to those of ordinary skill in the art, a dull solder alloy appearance meant that the alloy was doped with undesirable impurities that tended to impair the desirable properties of conventional tin-lead alloys
Although the dull appearance of more recent lead-free tin-copper solder alloys as described above no longer necessarily implies poor quality or undesirable impurities, the electronics industry has shown a strong bias against solder alloys with dull appearance and clearly Prefer a glossy, reflective weld look

Method used

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Embodiment Construction

[0009] Where a range such as 5-25 (or "5 to 25") is used herein, it means at least 5 and individually and independently, not more than 25. Also, all percentages herein are by weight unless expressly stated otherwise.

[0010] The lead-free solder alloys described herein exhibit reasonably good brightness and exhibit a glossy, highly reflective appearance, but in addition to possible traces from traditional commercial sources of the alloy components described below that are present as impurities in these components Except for lead, it is completely or substantially free of lead. The lead-free solder alloy consists of tin as a base material with a small amount of copper (typically less than about 5 wt%, more preferably less than about 2 or 1 wt%) and a smaller amount of cobalt (typically less than about 1 wt%, more preferably present). Preferably less than about 0.1 wt%, or nominally about 0.06%) constitute. Lead-free solder alloys can be manufactured or optimized for wave sol...

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Abstract

A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.

Description

[0001] This application claims priority to US Provisional Application No. 60 / 628,007, filed November 15, 2004, the contents of which are hereby incorporated by reference in their entirety. Background technique [0002] Solder compounds used to be tin-lead alloys. Specifically, tin-lead alloys offer a desirable combination of melting points, strength properties, and electrical properties (including conductivity) that have made them staple products used in the electronics industry for decades. [0003] However, with recent concerns about the environment, human health and worker safety, the industry has begun to look for alternatives to traditional leaded solder alloys - which perform the same job with comparable results. One such alternative alloy is a tin-copper alloy, which is a tin-based alloy that typically contains about or less than 1 wt% copper. Tin-copper alloys typically also include about 1 to 4 wt% silver. [0004] Although these alloys have demonstrated strength an...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22C22C13/00
Inventor S·R·罗特希尔德
Owner METALLIC RESOURCES