Washing liquid distribution device
A technology of cleaning liquid and liquid passage, which is applied in the directions of grinding/polishing safety devices, gas/liquid distribution and storage, electrical components, etc., which can solve problems such as waste and achieve the effect of reducing process costs
Inactive Publication Date: 2010-02-17
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology
[0004] The problem solved by the present invention is that in the paired cleaning liquid output ends of the existing cleaning liquid distribution device, each pair of cleaning liquid output ends cannot realize that one cleaning liquid output end outputs cleaning liquid, and the other cleaning liquid output end outputs deionized water at the same time , resulting in waste of cleaning fluid
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[0021] The present invention first provides a first embodiment of a cleaning liquid distribution device for chemical mechanical polishing equipment, including: a deionized water source; a chemical reagent source; a cleaning liquid liquid passage unit, the cleaning liquid liquid passage unit having at least: A deionized water input end connected to a deionized water source; at least one chemical reagent input end connected to a chemical reagent source; and one or more pairs of cleaning liquid output ends, the deionized water input end and the chemical reagent input The deionized water input end is connected to the first cleaning liquid output end of each pair of cleaning liquid output ends through a liquid passage; the deionized water input end is directly connected to the second cleaning liquid output end of each pair of cleaning liquid output ends through the liquid passage in the liquid passage unit Connected.
[0022] Reference figure 2 As shown, the cleaning liquid distribut...
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A washing liquid distribution and transportation device includes a deionized water source, a chemical agent source and a washing liquid access unit. The washing liquid access unit is provided with atleast one input end of the deionized water connected with the deionized water source; at least one input end of the chemical agent connected with the chemical agent source; and a pair or multiple pairs of output ends of the washing liquid. The deionized water inputted from the input end of the deionized water and the chemical solution inputted from the input end of the chemical agent can simultaneously output from one output end of each pair of the output ends of the washing liquid and can independently output the deionized water from the other output end of each pair of the output ends of thewashing liquid. The invention also provides a method for washing a wafer of the washing liquid distribution and transportation device. The invention can reduce the dose of the chemical agent in half,thus reducing the processing cost.
Description
Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a cleaning solution distribution device for cleaning wafers. Background technique [0002] Chemical Mechanical Polishing (CMP) technology is a combination of mechanical grinding and chemical etching. The chemical mechanical polishing technology uses the grinding action of ultrafine particles and the chemical corrosion action of the slurry to form a smooth and flat surface on the surface of the grinding medium Plane has now become the dominant technology in the semiconductor processing industry. Chemical mechanical polishing is the product of the development of integrated circuits (IC) to miniaturization, multi-layering, thinning and planarization. It is also the transition of wafers to 200mm, 300mm and even larger diameters, improving production efficiency, reducing manufacturing costs and overall substrate Process technology necessary for flattening. For example, a t...
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IPC IPC(8): H01L21/304B24B55/00B24B29/02F17D1/08F17D3/01
Inventor 陆琛
Owner SEMICON MFG INT (SHANGHAI) CORP