Thermal head and manufacturing method thereof

Abstract

A thermal head and a manufacturing method capable of forming a heat insulating layer having excellent thermal responsiveness, and setting the curvature radius of the heat insulating layer in the vicinity of heat radiating parts to a dimension which does not affect printing quality are provided. The thermal head includes an insulating head substrate, a heat insulating layer formed in the shape of a circular arc with a desired height and base dimension on a surface of the head substrate, heat radiating parts composed of resistive elements formed at an apex of the heat insulating layer. The surface of the head substrate is formed with a heat insulating layer forming part whose width is equal to the base dimension of the heat insulating layer. The heat insulating layer is formed with a predetermined height T on the heat insulating layer forming part. The curvature radius of the circular arc-shaped heat insulating layer in the vicinity of the heat radiating parts is set to a desired dimension.

Description

technical field [0001] The present invention relates to a thermal head and a manufacturing method thereof, and more particularly to a line thermal head mounted on a thermal transfer printer for printing images on recording paper and a manufacturing method thereof. Background technique [0002] Conventionally, thermal transfer printers have been widely used as output devices such as computers, which perform thermal transfer of ink on an ink ribbon by selectively heating a plurality of heat generating parts formed on a thermal head based on printing information. By printing, a desired image can be printed on the recording paper. [0003] As shown in FIG. 5 , a conventional thermal head used in the thermal transfer printer includes a head substrate 21 made of an insulating material such as ceramics and having a flat surface. In the vicinity of one end of the flat surface of the head substrate 21 , an insulating layer 22 protruding in an arc shape with a predetermined height is...

AI Technical Summary

Problems solved by technology

[0015] However, in the existing thermal head, in order to form the thermal insulation layer 24 with small heat capacity and excellent thermal responsiveness shown in FIG. The prepared glass paste flows on the surface of the flat head substrate 21 to form a thermal insulation layer 24' shown by the dotted line in FIG.

[0016] Therefore, the contact area between the heat-insulation layer 24' and the head substrate 21 is enlarged, so that the thermal capacity is larger than that of the heat-insulation layer 24 composed of the desired height T and width W, and the thermal responsiveness is lower than the desired value.

[0017] In addition, if the thermal insulation layer 24' shown by the dotted line in FIG.

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