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Semiconductor device

A technology for semiconductors and conductive components, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components

Inactive Publication Date: 2012-10-03
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since the conductive film made of metal material has ductility, when it is cut by a cutting tool, it is drawn to extend in the moving direction of the cutting tool, and in this moving direction Glitch on the downstream side

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] figure 1 It is a schematic cross-sectional view showing the structure of the semiconductor device according to the first embodiment of the present invention.

[0037] This semiconductor device 1 includes a wiring board 2 and a semiconductor chip 3 having a functional surface 3 a on which a functional element 4 is formed. The semiconductor chip 3 is connected in such a way that the functional surface 3a faces the surface of the wiring board 2 and is connected with the surface 2a by the connection member 5 at a predetermined distance.

[0038]In the vicinity of the end surface 2 e of the wiring board 2 , a conductive film 6 made of a metal material such as copper (Cu) is formed. Conductive film 6 includes: external connection portion 6T formed continuously on the surface (rear surface) opposite to end surface 2e and surface 2a; The wiring portion 6W and the external connection portion 6T are integrally formed. The connection member 5 is formed over the wiring portion ...

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Abstract

A method for manufacturing semiconductor devices (1, 21) includes a step of preparing a base board (11), which has a plurality of wiring boards (2) formed thereon and has a conductive member (13) formed over a boundary of the adjacent wiring boards on at least one surface (2a); a chip connecting step for connecting a semiconductor chip (3), which has a functional surface (3a) whereupon a functional element (4) is formed, to each wiring board by permitting the functional surface to face the one surface at a prescribed interval; a sealing resin layer forming step for forming a sealing resin layer (7) in a space between the base board and the semiconductor chip and on the conductive member after the chip connecting step; and a step of cutting the base board along the boundary of the adjacentwiring boards by relatively moving the base board and a cutting tool (B) to permit the cutting tool to penetrate to the one surface from the other surface (2b) on the opposite side to the one surfaceof the base board after the sealing resin layer forming step.

Description

technical field [0001] The present invention relates to a semiconductor device having a wiring substrate and a semiconductor chip connected thereto, and a method of manufacturing the same. Background technique [0002] A semiconductor device includes: a wiring board; and a semiconductor chip connected so that a functional surface on which a functional element is formed faces one surface of the wiring board. [0003] A conductive film is formed on the wiring substrate from the above-mentioned one surface to which the semiconductor chip is connected, through the end surface of the wiring substrate to the other surface on the opposite side of the above-mentioned one surface. The conductive film is formed across the other surface from the end surface of the wiring substrate, and includes: an external connection portion for connecting the semiconductor device to the mounting substrate; formed on the other surface of the wiring substrate, and connects the semiconductor chip and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12H01L21/56
CPCH01L2224/73203H05K3/42H05K3/284H05K2201/09181H01L2924/01004H01L2224/73204H01L23/49805H01L2924/01078H01L21/563H05K2203/1581H05K3/403H01L2224/16225H01L23/49833H05K3/0052H01L2224/81191H05K2201/0394H01L2224/32225H01L2924/00011H01L2924/00014H01L2924/00H01L2224/0401H01L21/76
Inventor 谷田一真宫田修
Owner ROHM CO LTD
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