Power-feeding conductive tape, its manufacturing method, and manufacturing method of solid electrolytic capacitor using it
A manufacturing method and technology of conductive strips, applied in the direction of solid electrolytic capacitors, electrolytic capacitors, capacitor manufacturing, etc., can solve the problems of high material cost, inability to use, and obstruction of power supply, etc.
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Embodiment approach 1
[0023] figure 1 It is a cross-sectional view of the conductive tape 101 for power feeding according to Embodiment 1 of the present invention. The conductive tape 101 for power feeding includes a metal base foil 1 having a surface 1A and a surface 1B opposite thereto, a metal thin film layer 2 on the surface 1A, and an adhesive layer 3 on the surface 1B. The metal base foil 1 is obtained by rolling aluminum 1085 to have a thickness of 30 μm and a width of 180 μm. Metal thin film layer 2 is formed by vacuum-plating nickel on surface 1A of metal base foil 1 and has a thickness of 0.1 μm. Then, the metal substrate foil 1 having a width of 180 mm and having a metal thin film layer 2 and an adhesive layer 3 formed on both surfaces thereof was cut by a slitter at a width of 7.5 mm to obtain a conductive tape 101 for power feeding. Before the metal base foil 1 is cut, the protective tape 53 may be pasted on the adhesive layer 3 . The protective tape 53 is cut together with the met...
Embodiment approach 2
[0033] figure 2 It is a cross-sectional view of the conductive tape 102 for power feeding according to Embodiment 2 of the present invention. The conductive tape 102 for power feeding includes a metal base foil 4 having a surface 4A and a surface 114B opposite to it, a metal thin film layer 5 on the surface 4A, a resin film 6 on the surface 114B, and an adhesive layer on the resin film 6. 7. The metal base foil 4 is made of 1085 aluminum. The resin film 6 is made of polyethylene terephthalate (PET).
[0034] Next, a method of manufacturing the conductive tape 102 for power feeding will be described. The resin film 6 was pasted on the surface 114B of the metal base foil 4 having a width of 180 mm and a thickness of 30 μm. Then, nickel was vacuum-coated on the surface 4A of the metal base foil 4 to form a metal thin film layer 5 with a thickness of 0.1 μm. An adhesive layer 7 is formed on the resin film 6 . Then, the metal substrate foil 4 having a width of 180 mm and hav...
Embodiment approach 3
[0045] image 3 It is a cross-sectional view of the conductive tape 103 for power feeding according to Embodiment 3 of the present invention. The conductive tape 103 for power feeding includes a metal core foil 8 having a surface 8A and its opposite surface 8B, a metal covering foil 81 on the surface 8A, a metal covering foil 82 on the surface 8B, and a metal thin film layer on the metal covering foil 81. 10 and the adhesive layer 11 on the metal cover foil 82. The metal core foil 8 is composed of aluminum 5052 which has greater tensile strength than aluminum 1085 . Metal cover foils 81 and 82 consist of aluminum 1050 . Metal core foil 8 and metal cover foils 81 , 82 form metal base foil 180 . Metal base foil 180 has surface 180A formed by metal covering layer 81 , and surface 180B formed by metal covering foil 82 on the opposite side to surface 180A. That is, the metal thin film layer 10 is provided on the surface 180A, and the adhesive layer 11 is provided on the surface 1...
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Abstract
Description
Claims
Application Information
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