Printed circuit board production method and equipment

Abstract

In order to produce a printed circuit board while stabilizing the line width of a pattern, a laminator (2) laminates a resist layer on a substrate (K) and exposes information indicative of the date of lamination to the substrate (K). An exposure device (3) reads out the information on the date of lamination before exposure and judges whether the time elapsed after lamination falls within a predetermined hold time or not. If the judgment is negated, an operator is warned by the exposure device (3) that the time elapsed after lamination deviates from the predetermined hold time. Since a desired line width cannot be attained for that substrate (K), the operator can remove that substrate (K) from the exposure device (3).

Description

technical field [0001] The present invention relates to a method and an apparatus for manufacturing a printed wiring board manufactured through a lamination process, an exposure process, and a development process. Background technique [0002] Generally, printed circuit boards are manufactured through the following processes. First, a lamination process is performed in which a dry film resist layer (hereinafter simply referred to as a resist layer) is laminated on a conductive layer (for example, a copper thin film) formed on a substrate for forming a circuit pattern, so that The dry film resist layer is formed of a photosensitive material that hardens by photopolymerization when irradiated with light. Next, an exposure step is performed in which the resist layer is exposed with a light beam in a pattern having the same shape as the circuit pattern. Then, the portion of the resist layer that is not irradiated with the beam is removed through a developing process to form a ...

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Problems solved by technology

Therefore, if exposure is performed in such a state, the problem that the line width of the pattern becomes thick as in the case after the lamination process occurs.

[0008] In addition, since the photopolymerization reaction of the resist layer has not sufficiently progressed just after the exposure process, if the development is performed immediately after exposure, the line width of the pattern will become thinner.

If the development process and etching process are performed in such a state, problems such as increased resistance or impedance of the manufactured printed circuit board or disconnection may occur.

[0009] In addition, if the printed circuit board is left for a long time after the exposure process, the photopolymerization reaction will exceed the required level, so that the line width of the pattern will become thick

Therefore, if the development process and the etching process are performed in such a state, there will be a problem that the line width of the circuit pattern will become thicker as in the case where the exposure is performed immediately after the lamination process.

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