Unlock instant, AI-driven research and patent intelligence for your innovation.

Image sensing measurement device and camera module using this device

An image sensing and lens module technology, applied in image communication, color TV parts, TV system parts, etc., to achieve stable quality, reduce module size, and improve image quality

Inactive Publication Date: 2010-12-08
LUXVISIONS INNOVATION LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the image sensing device in the conventional technology uses a flip-chip packaging method to grow conductive bumps on the sensor chip, so it is easy to cause pollution to the image sensing device in the process of growing the conductive bumps on the sensor chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensing measurement device and camera module using this device
  • Image sensing measurement device and camera module using this device
  • Image sensing measurement device and camera module using this device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] see figure 1 , figure 1 It is a schematic structural diagram of an embodiment of the image sensing device 150 of the present invention. The image sensing device 150 of the present invention is manufactured by flip-chip (Flip Chip, FC) process technology, such as figure 1 As shown, the image sensing device 150 includes a substrate 152 , a filter 154 and a sensor chip 156 . Since the assembly method of the image sensing device 150 is well known in the industry, it will not be repeated here.

[0023] see figure 2 and image 3 , figure 2 for figure 1 An external view of substrate 152 is shown, while image 3 for figure 1 A top view of the sensor chip 156 is shown. Such as figure 2 As shown, there is an opening 153 in the middle of the substrate 152, and at least one conductive bump 155 is disposed on the substrate 152, and the side of the substrate 152 has a conduction channel 159 used as a side connection to sense the image sensing device 150. The image ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A kind of image sensing device includes an underlay, a filter and a sensor chip. The underlay possesses an opening. The filter is set on upper surface of the underlay and covers the opening. The sensor chip is electric connected with the underlay, and the sensor chip includes: a sensitization area which is corresponding with the opening.

Description

technical field [0001] The present invention relates to an image sensing device, in particular to an image sensing device using a flip-chip process and growing conductive bumps on the surface of a substrate and a lens module using the image sensing device. Background technique [0002] The packaging methods of general image sensing devices, except Chip Scale Package (CSP) packaging is Chip On Board (COB) packaging, the former is limited by the resin (epoxy) added to the packaging. , so the resolution and image quality performance is relatively poor, and although the image quality of the image sensing device packaged by the chip carrier board is high, the package method of the chip carrier board needs to be wire-bonded, and it is difficult to maintain the sensor in the image sensing device. The cleanliness of the chip cannot effectively reduce the height of the camera module using the image sensing device, and the size of the module is larger than that of various packages du...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H01L27/14H04N25/00
Inventor 郑贤豪
Owner LUXVISIONS INNOVATION LTD