Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function

A technology for cutting devices and workpieces, applied in glass cutting devices, electrical components, manufacturing tools, etc., can solve problems such as fragmentation, lack of small pieces, workpiece distortion, etc., to achieve the effect of reducing friction, easy handling, and preventing chipping

Active Publication Date: 2008-01-02
THK CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, with the conventional cutting method shown in FIG. 29, when cutting, the two cut workpieces rub against each other on the back of the workpiece, so that chipping will occur on the back of the workpiece represented by part A in the figure ( missing flakes)
In addition, if the pressurization force of the truncated head is increased, the workpiece will also be twisted

Method used

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  • Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function
  • Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function
  • Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function

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Experimental program
Comparison scheme
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Embodiment

[0118] (1) Device overview

[0119] In order to investigate the expansion effect, only the test tool of the expansion mechanism was produced as a trial (Fig. 13). Its appearance size is 410mm×450mm. In this test tool, tension can be applied to the workpiece only in the X direction, and in a compound direction of the X-Y direction. The clamping of the sheet is achieved by combining grooved plates and fixing them with bolts. The entire range of foils can be clamped by means of the grooved plate. While looking at the scale, adjust the tension with the bolt of the "tension part" in the picture.

[0120] (2) Outline of slices suitable for expansion

[0121] Dicing tapes used were D-650 and D-675 (manufactured by Lintec (Adwill) Co., Ltd., width 300 mm, thickness 80 μm) for expansion, which are generally used when dicing silicon wafers. Cut these tapes to the appropriate length for use.

[0122] (3) Expansion effect when truncating the wafer

[0123] The silicon wafer was pas...

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PUM

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Abstract

A method and a device for breaking a work, a method for scribing and breaking the work, and a scribing device with a breaking function. The method for breaking the work (5) capable of preventing chipping from occurring on the rear surface of the work due to rubbing when the work having a scribe line marked on the surface thereof is broken comprises a work adhering step for stamping the rear surface of the work (5) on an extensible sheet (9), a sheet pulling step for pulling the sheet (9) on which the work (5) is stamped, and a work parting step for moving the scribe line (5c) to the rear surface of the work (5) in the pulled state of the sheet (9). Since the work (5) is pulled off immediately after the work (5) is parted by the tensile force of the sheet (9), the rubbing of the parted work (5) is reduced and the chipping can be prevented from occurring on the rear surface of the work. Also, since the tensile force provided to the work (5) assists in parting the work, the work (5) can be parted with a smaller force.

Description

technical field [0001] The present invention relates to a cutting method and device for cutting workpieces made of brittle materials such as semiconductor wafers and glass, a scribing and cutting method, and a scribing device with a cutting function. Background technique [0002] As a method of cutting workpieces made of brittle materials such as semiconductor wafers and glass into predetermined shapes, a dicing method in which the workpieces are fed to a rotary blade and cut into cubes is used. In this cutting method, the portion of the workpiece that is fed into the rotating blade is completely removed. [0003] In recent years, instead of the cutting method, a cutting method of cutting the workpiece by causing a crack to develop along the scored line by the cutting device after marking the surface of the workpiece by a scribing device has been adopted (for example, refer to Patent Document 1 [0001]~[0004]). [0004] Fig. 29 shows a schematic diagram of a conventional tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C03B33/033C03B33/02
Inventor 中泽东治下土敬由星野京延三户雅德羽生明夫河野贵哉宍户善明
Owner THK CO LTD
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