A graphite-metal compound heat dispersion base material and its making technology

Abstract

The invention provides a graphite-metal compound heat delivery base material and the production technique thereof. Sheet metal is pressed into a preformed mould to produce a shell with the metal layer of specific structure and the corresponding cover board. Metal columns upright towards are provided at the bottom of the metal-layered shell, and the cover board has holes therein corresponding with the metal columns; the raw graphite material is pressed into a graphite material layer with certain thickness and holes which matches with the holes in the metal-layered shell; The pressed graphite material layer is put into the metal-layered shell with the metal cover board covered so that a mould is formed by pressing. The encapsulation of the graphite material layer by the metal layer is realized through the rivet connection of the cover board by the metal columns. No heat treatment is involved in the production process in the invention and the production cost is greatly reduced. With the metal-layered shell used, the molding technique is easier and the heat delivery base material with different shapes can be produced. The metal columns, which run through the graphite layer, strengthen the structure of the base material and facilitate the heat delivery.

Description

(1) Technical field [0001] The invention relates to a graphite-metal composite material, in particular to a structure and a preparation method of a graphite-metal composite base material used as a heat dissipation device. (2) Background technology [0002] In recent years, electronic products such as LSI, digital cameras, mobile phones, notebook computers, and LEDs are constantly developing towards high-density packaging and multi-functionalization, which makes the problem of heat dissipation of semiconductor chips increasingly prominent, especially after the temperature of the new generation of semiconductor materials rises. , the working performance deteriorates sharply (every time the temperature rises by 10°C, the average life of the components is reduced by about 1 / 3), and in severe cases, it may even cause a sudden increase in heat dissipation inside the machine, resulting in instability of electronic products and other consequences. [0003] At present, the packaging ...

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Problems solved by technology

It can be seen from the above two patents that the preparation of graphite-based heat sinks is complex, with long cycle times and large investments.

The former has an epoxy resin layer between graphite and metal, and its thermal conductivity is affected

The latter is not only complicated in its production process, but also difficult to guarantee the strength of the product

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