Printed circuit board with heat dispersion structure
A technology for printed circuit boards and heat dissipation structures, which is applied to printed circuit components, printed circuits connected with non-printed electrical components, cooling/ventilation/heating transformation, etc., and can solve the problem of long circuit grounding loops and increasingly demanding device grounding The higher the temperature, the inability to work stably, etc., the effect of improving the heat dissipation performance can be achieved
Active Publication Date: 2008-01-16
AUCTUS TECH CO LTD
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AI Technical Summary
Problems solved by technology
[0005] At present, there are more and more cases of using various forms of prepreg to bond the printed circuit board body and the metal substrate, but the grounding problem has not been solved for a long time
This will lead to a long circuit ground loop on the printed circuit board body, which is easy to introduce interference
In addition, if the ground pins of some sensitive devices cannot be grounded nearby, they cannot work stably or even realize their original functions, especially on some high-complexity and high-density analog circuit boards, such as the third generation (3G) The circuit board that integrates the transceiver of the communication system has higher and higher requirements for the nearby grounding of the device
Method used
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[0014] The structure of the printed circuit board with heat dissipation structure of the present invention is shown in Figure 2 and Figure 3, including a printed circuit board body 1, a prepreg 2 and a heat dissipation structure, and a prepreg is sandwiched between the printed circuit board body 1 and the heat dissipation structure 2. A tin injection hole 8 connected to the ground pad 9 is provided at an idle position near the ground pad 9 on the printed circuit board body 1, and the tin injection hole 8 runs through the circuit board body 1 and the ground pad 9. In the prepreg 2 , the solder injection hole is filled with solder that conducts the ground pad 9 with the heat dissipation structure. The inside of the tin injection hole 8 is metallized. The heat dissipation structure includes a metal substrate 3 and a heat sink 4, the metal substrate 3 is sandwiched between the heat sink 4 and the prepreg 2, and the solder filled in the tin injection hole 8 connects the metal subst...
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The invention discloses a print circuit board with heat dissipation structure, including a print circuit board body, semisolid sheet and a heat dissipation structure, wherein the semisolid sheet is sandwiched between the print circuit board body and the heat dissipation structure; stannum-injecting holes are communicated with grounded pads and are equipped at the unoccupied location in the vicinity of the grounded pads on the print circuit board body; the stannum-injecting holes run through the circuit board body and the semisolid sheet; the stannum-injecting holes are filled with soldering tin so that the grounded pads are communicated with the heat dissipation structure. The invention enables the grounded pads to be grounded in the shortest distance without affecting wiring laying by the stannum-injecting holes equipped at the unoccupied location in the vicinity of grounded pads; meanwhile, the stannum-injecting holes are filled with soldering tin, which is more advantageous to transfer the heat of a device to the heat dissipation structure more quickly, therefore, the heat dissipation performance of the circuit board is further improved.
Description
technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with a heat dissipation structure. Background technique [0002] For analog circuits, especially high-power amplifier circuits, in order to improve their heat dissipation performance, the body of the printed circuit board is often closely attached to a metal substrate, and then installed on the radiator of the system. The material used to bond the metal substrate and the printed circuit board body has a high thermal conductivity, which can quickly transfer the heat on the printed circuit board body to the metal substrate, and then dissipate it through the radiator. And if the body of the printed circuit board is directly fixed on the heat sink, because the reverse side of the body of the printed circuit board is often uneven due to tin spraying, the body of the printed circuit board and the heat sink cannot be tightly bonded, which seriously affects the heat diss...
Claims
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IPC IPC(8): H05K7/20H05K1/02H05K1/18
Inventor 马如涛刘林涛韩华
Owner AUCTUS TECH CO LTD