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Pressure-sensitive conductive rubber and method of preparing the same

A conductive rubber and silicone technology, applied in the field of conductive materials, can solve the problems of high cost, difficulty in applying robots, and large temperature effects.

Inactive Publication Date: 2008-01-23
HENAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production of monocrystalline silicon sensors requires relatively complex integrated circuit technology, while the production of ceramic diaphragm sensors also has high technical requirements for the diaphragm, the process is complex, the cost is high, and it is greatly affected by temperature. In many cases, it needs temperature compensation
When developing robots, the above two sensors are far from human skin tissue, and it is difficult to apply them to robots with tactile functions.

Method used

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  • Pressure-sensitive conductive rubber and method of preparing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] (1) Ingredients, each component by weight ratio, take 1 part of mold silica gel, 2 parts of 200 mesh nickel powder and dilute with an appropriate amount of 99.8% concentration of toluene, stir evenly until it is viscous (you can see the halo formed when stirring ), try to avoid the sinking of nickel powder.

[0011] (2) For the first curing, add 0.012 parts of curing agent to the above-mentioned viscous rubber, cover it and put it in a constant temperature box at 50°C for the first curing, and take it out after 4 hours (the colloid should be relatively wet when taken out) , crushed.

[0012] (3) For the second curing, add 0.024 parts of curing agent to the above powder, stir and mix, and cure in a 30°C thermostat for 48 hours to produce the pressure-sensitive conductive rubber of the present invention.

Embodiment 2

[0014] (1) Ingredients, each component by weight ratio, take 1 part of mold silica gel, 2.5 parts of 200 mesh nickel powder, will nickel powder and 0.035 part of 200 mesh ZrO 2 Put it into a mortar and grind until fully mixed, then mix it into the mold silica gel and dilute it with an appropriate amount of 99.8% toluene, stir evenly until it becomes viscous (you can see the halo formed during stirring), try to avoid the nickel powder from sinking.

[0015] (2) For the first curing, add 0.012 parts of curing agent to the above-mentioned viscous rubber, cover it and put it in a constant temperature box at 70°C for the first curing, and take it out after 4 hours (the colloid should be relatively wet when taken out) , crushed.

[0016] (3) For the second curing, add 0.028 parts of curing agent to the above powder, stir and mix, and cure in a 40°C thermostat for 48 hours to produce the pressure-sensitive conductive rubber of the present invention.

Embodiment 3

[0018] (1) Ingredients, each component by weight ratio, take 1 part of mold silica gel, 3 parts of 200-mesh nickel powder, nickel powder and 0.04 part of 200-mesh ZrO 2 Put it into a mortar and grind until fully mixed, then mix it into the mold silica gel and dilute it with an appropriate amount of 99.8% toluene, stir evenly until it becomes viscous (you can see the halo formed during stirring), try to avoid the nickel powder from sinking.

[0019] (2) For the first curing, add 0.012 parts of curing agent to the above-mentioned viscous rubber, cover it and put it in an incubator at 80°C for the first curing, and take it out after 3.5 hours (the colloid should be relatively wet when taken out) , crushed.

[0020] (3) For the second curing, add 0.034 parts of curing agent to the above powder, stir and mix, and cure in a constant temperature oven at 50°C for 48 hours to produce the pressure-sensitive conductive rubber of the present invention.

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Abstract

The invention discloses a pressure-sensitive conductive rubber and the preparation method, which relates to conducting materials sensitive to the pressure. The objective of the invention is to provide a pressure-sensitive conductive rubber with good electric resistance sensitive property and the preparation method. The technical proposal of the invention is that the pressure-sensitive conductive rubber comprises the silica gel and the nickel powder with weight ratio of 1 : 2 to 3; the silica gel is the mould silica gel and the grain size of the nickel powder is not more than 70Mum. the preparation of the pressure-sensitive conductive rubber has the following steps: (1) the nickel powder is mixed with the silica gel and is added with organic benzene solution with right amount to stir uniformly to form the viscous compound; (2) a curing agent is added into the compound and is put in a thermotank to solidify for 4h under the temperature of 45 DEG C. to 85 DEG C. and is taken out to crush; (3) the curing agent is fully mixed with the powders after solidifying to solidify for 48h under the constant temperature of 30 DEG C. to 50 DEG C. to produce the pressure-sensitive conductive rubber of the invention. The invention is applied in the pressure-sensitive conductive rubber.

Description

Technical field: [0001] The invention relates to a pressure-sensitive conductive material, in particular to a pressure-sensitive conductive rubber and a preparation method thereof. Background technique: [0002] The current piezoresistive sensors mainly use the integration process to integrate the resistance strips on the monocrystalline silicon diaphragm to make silicon piezoresistive chips or piezoresistive sensors based on ceramic diaphragms. The production of monocrystalline silicon sensors requires relatively complex integrated circuit technology, while the production of ceramic diaphragm sensors also has high technical requirements for the diaphragm, the process is complex, the cost is high, and it is greatly affected by temperature. Perform temperature compensation. When developing robots, the above two sensors are far from human skin tissue, and it is difficult to apply them to robots with tactile functions. [0003] In 1998, the British Perapedhi company developed...

Claims

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Application Information

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IPC IPC(8): C08L83/00C08K3/08H01B1/22
Inventor 常方高杨枫
Owner HENAN NORMAL UNIV
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