Method for manufacturing heat conducting module

Abstract

The invention provides a heat conduction module and the manufacturing method to diverse the heat generated by the electronic components, the heat conduction module comprises a heat conduction board and a plurality of heat tubes, wherein the top surface of the heat conduction board is provided with a plurality of mutual parallel concave grooves, the concave grooves are respectively pronged the front and back end surface of the heat conduction board, and an arc surface is formed under the groove, the two sides on the top of the concave groove are respectively extended inwards to form blocks; one end of the heating tube is heated segment, another end is heating segment, the heated segment penetrated into the concave groove of the heat conduction board, and mutually contacted with the inner wall of the concave groove and the inner wall of the block; so the hold stability and the airproof between the heat conduction board and the heating tube can be ensured, so as to enhance the heat conduction performance of the heat conduction module.

Description

technical field [0001] The invention relates to a heat conduction module and a manufacturing method thereof, in particular to a heat conduction module for providing heat conduction of electronic components and a manufacturing method thereof. Background technique [0002] At present, in the conduction and heat dissipation of electronic components, the industry uses the characteristics of high heat transfer capacity, fast heat transfer, high thermal conductivity, light weight, simple structure and multi-purpose of heat pipes, which can transfer a large amount of heat without resorting to auxiliary materials. Electricity, so it is very suitable for the conduction and heat dissipation requirements of electronic products, and the heat conduction module composed of heat pipe and heat conduction plate, the combination of good and bad will directly affect the heat conduction performance and holding stability of the heat conduction module, so how to increase the heat pipe and heat con...

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Problems solved by technology

[0004] However, the existing heat conduction module still has the following problems in actual use. Since the two sides of the top of the groove extend along the direction of the arc and are in a sharp angle, it is difficult for the heat pipe to The clamping force is quite small, and it is easy to loosen and separate the heat pipe and the heat conduction plate due to the touch during assembly or the vibration during operation, which will lead to many problems such as poor heat conduction performance and poor holding stability. , and needs to be improved

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