Duplex high precision temperature controller

Abstract

The present invention discloses a multipath high-precision temperature controller, and comprises a port board and a temperature control board, and is applied to the back bonding hot pressing solidification. The temperature control board comprises a collecting module, a driving module, a control module, a communication module, and a power supply module. A process controller sets the hot pressing head working temperature, and the set value is outputted to the control module through the port board and the communication module. The collecting module outputs the hot pressing head temperature value collected by a platinum resistor to the control module, at the same time performs the linearization processing for the temperature characteristic of a sensor. The control module compares the temperature set signal with the collected temperature signal, the difference signal of the temperature set signal and the collected temperature signal is performed by the PID operation to produce the control signal which is outputted to the driving module. The driving module adopts the PWM way to control a field effect transistor for driving the heating element of the hot pressing head. The present invention can realize the temperature control precision with being plus or minus 1 DEG C for the hot pressing head in between o DEG C and 300 DEG C, and realize the temperature control of 2048 hot pressing heads at beast through the expanding port board, the temperature control board, and the hot pressing heads.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging equipment manufacturing, and specifically relates to a variety of high-precision temperature controllers, which are especially suitable for the high-precision temperature control of multiple thermal pressure heads during the thermal pressure curing process of flip-chip bonding machines, and are also suitable for other Instrument and equipment manufacturing fields that require high-precision temperature control. Background technique [0002] Flip chip bonding (Flip Chip) is a method in which chips are directly mounted and interconnected with a substrate in a bump array structure. It mainly includes processes such as thermosonic bonding, reflow soldering, and conductive adhesive bonding. Among them, conductive adhesive bonding is based on isotropic conductive adhesive (Isotropic Conductive Adhesive, ICA), anisotropic conductive adhesive (Anisotropic Conductive Adhesive, ACA) and non-conductive...

AI Technical Summary

Problems solved by technology

[0004] Existing temperature controller designs (such as patent documents 03224231.X, CN2072244U, CN1453674A, etc.) can achieve high control accuracy in the temperature range of 0-100 °C, but cannot meet the 0 The control accuracy requirement of ±1°C within the temperature range of ~300°C

Most of the existing multi-channel temperature control schemes are implemented by combining multiple single-channel temperature controllers, which have disadvantages such as complex structure, large volume, and high cost, and cannot meet the low-cost and high-efficiency production requirements of RFID flip-chip bonding equipment

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