A method and testing backboard for single board production test

Abstract

The utility model discloses a method for single-chip board production test, wherein the single-chip board production test is realized by inserting the test single-chip board into a test backboard. The method comprises the steps that: the measured single-chip board produces an excitation signal, which is preferred to be a pseudo random binary sequence bit stream and is sent to the test backboard; the test backboard sends the excitation signal back to the measured single-chip board via a circuit interface loopback; the measured single-chip board checks the sent back excitation signal, and judges whether the measured single-chip board is normal according to the sent back excitation signal. Correspondingly, the utility model also provides a test backboard. Thereby, the utility model needs not to add the hardware cost to the measured single-chip board; the test cost is greatly reduced; the testing efficiency is improved; and the production test requirements needed by mass production are satisfied.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a single board production test method and a test backboard. Background technique [0002] In the communication system, it is necessary to test the communication equipment to quickly locate the equipment failure. Usually, the communication equipment test is divided into online test and offline test, while production test belongs to offline test. The production test is mainly to check whether there are defects in the production and processing, and whether there are problems such as component damage. [0003] Most of the communication devices in the communication system are composed of single boards, so the production test of the single board becomes the first hurdle of equipment testing. The production test of the single board mainly uses the external business interface of the single board to send various excitation signals to the single board input interface, and then for...

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of this technology is that it needs to build equipment and instruments and testers need to judge whether the feedback signal is correct, so the test cost is high. Due to the high test cost, too many instruments cannot be configured, so the efficiency of single board production test is very low in mass production.

Can refer to the veneer testing method and device that Chinese patent application 99118268.5 provides, it needs to provide excitation source externally, and whether external detection response signal is correct, and has also increased a CPU (Central Processing Unit, central processing unit) for veneer To process the test, the test device itself is complex and costly, and at the same time increases the hardware cost of the board itself

[0007] In summary, the existing veneer production testing methods obviously have inconveniences and defects in actual use, so it is necessary to improve them

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