Mechanical, electrical and heating integrated electronic enclosure

Abstract

The utility model relates to an electronic case of electrical-mechanical and thermal integration, which comprises a common motherboard, a plurality of angle strips, a plurality of cutting strips, a plurality of electrical connectors, a plurality of spring leaves, a corner pad and a plurality of circuit boards; wherein, the top part of the case is connected with the angle strips; each angle strip is magnetic sealed by the cutting strips; the common motherboard is positioned on the chassis of the case to realize the signal transmission between the circuit boards, and to make the specification to the circuit boards of different system equipments; the bottom of each circuit board is connected with the common motherboard through two electrical connectors; the top of each circuit board is connected with the top corner of the case; both ends of the circuit boards are positioned in the slots of the former board and the rear board of the case, and is fixed by the slots on both sides of the spring leaves and the corner pad to decrease vibration. The signal transmission of each circuit board in the case is operated by the common motherboard to reduce the number and the configuration weight of cables and the electric connectors which can save the space in satellites for the installation, and damping vibration within the combination of the spring leaves and the corner pad which is positioned on both sides of the slot in the circuit boards, and the purpose of vibration damping is good.

Description

technical field [0001] The invention relates to an electronic cabinet, in particular to an electronic cabinet based on a micro-satellite platform public electronic cabinet with electromechanical and thermal integration. Background technique [0002] At present, each sub-system equipment of the satellite adopts an independent electronic chassis, and is connected to each other through various cables to form a complex and independent structure. This structure is not only complicated to manufacture, but also has many cables, large weight and volume, and the assembly process is also relatively complicated, which is not suitable for the application of small satellites, especially microsatellites. [0003] With the development of micro-miniature technology, small satellites and micro-satellites are also developing in the direction of miniaturization and light weight. At present, the sub-system equipment of small satellites and micro-satellites at home and abroad basically follow th...

AI Technical Summary

Problems solved by technology

[0004] At present, there are three forms of integrated chassis, one is the "EMC design of a certain type of chassis" published by Liu Jiangyan in the first issue of "Marine Electronic Engineering" in 2006 (Vol.26No.1P172), which mainly introduces the chassis EMC ( Electromagnetic shielding) design. In this article, it can only be seen that multiple circuit boards are installed in the same chassis, and each circuit board is electromagnetically shielded by a shielding box. Signals are transmitted between each circuit board through cables. The number of cables Many, complex layout, the circuit board is directly installed in the slot, no vibration reduction design

One is: Patent No. ZL200520122044.8, application date: September 23, 2005. Patentee: AAEON Technology Co., Ltd., the utility model patent titled "Expandable Architecture of Industrial Chassis" published through the two sides of the chassis Screw the circuit board with the transmission interface and most expansion slots. This installation method is simple and convenient, but the structure is heavy, the vibration damping performance is not good, and the electromagnetic compatibility and thermal control problems are not considered, so it is not suitable for the aerospace industry.

The other is the application number 200420014208.0, the application date was October 12, 2004, and the applicant Huawei Technologies Co., Ltd. announced "an integrated chassis" which mainly uses a metal labyrinth structure for electromagnetic shielding. The circuit board is complicated and unpublished Installation and vibration reduction, signal transmission, thermal control methods, etc.

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