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Radiating module used for projection device

A technology for a heat dissipation module and a projection device, which is applied to projection devices, optics, instruments, etc., can solve the problems of increasing system noise, increasing the cooling air flow resistance, and detrimental to the internal heat dissipation of the DLP projector 10.

Active Publication Date: 2008-03-05
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, although the phenomenon of light leakage can be eliminated, because the shading sheet 17 is placed at the ventilation hole 191, it will increase the flow resistance of the cooling air flow, which is not conducive to the internal heat dissipation of the DLP projector 10; increase system noise

Method used

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  • Radiating module used for projection device
  • Radiating module used for projection device
  • Radiating module used for projection device

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Embodiment Construction

[0042] FIG. 2 shows the structure of the first embodiment of the projection device 20 of the present invention. Generally speaking, the projection device 20 includes a light source 21, an optical machine 23, a DMD module 25, and a heat dissipation module 30. The projection device 20 may also include other necessary components for projection, such as a printed circuit board 26, etc., which will not be described in detail here. . In addition, in this embodiment, fans 22 and 24 can be provided at appropriate positions to form a cooling air flow in the projection device 20 , and the above-mentioned components are all arranged in the casing 29 to perform normal projection functions.

[0043] Wherein, the DMD module 25 also includes a DMD chip 251, the DMD chip 251 is used to process the light provided by the light source 21 and the input image signal, so it becomes the main heating part. The heat dissipation module 30 of the present invention provides a heat dissipation function f...

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Abstract

The cooling module is used for cooling a DMD module. It comprises a heat conducting unit, at least a heat pipe, and at least a fin. The heat conducting unit transmitting the heat of the DMD module to the fin through the heat pipe; the fin is used to radiate the heat; the fins can be stacked in the direction of light source in order to shield the light so as to avoid the light from the light source goes to outside of the case.

Description

technical field [0001] The invention relates to a heat dissipation module for a projection device; in particular, it relates to a heat dissipation module for a digital light processing projector. Background technique [0002] Projectors have become image devices commonly used in offices, homes, and meeting rooms. Currently, commonly used projectors can be divided into two types: liquid crystal (LCD) projectors and digital light processing (Digital Light Processing, DLP) projectors. Among them, DLP projector is a real use of digital projection and display technology, which has attracted much attention from the market. [0003] Among them, the core technology of DLP is the digital micromirror device (Digital Micromirror Device, DMD) module. The DMD module is composed of a micro-mirror array obtained by the semiconductor manufacturing process. Each mirror represents a pixel. When the light source is projected onto the DMD module , the DMD module can transmit it together with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B21/16
Inventor 林嘉瑞张国卿林慧芝
Owner DELTA ELECTRONICS INC