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Grinding pad with hollow fiber and manufacturing method thereof

A grinding pad and hollow technology, which is applied in the direction of manufacturing tools, semiconductor/solid device manufacturing, grinding devices, etc., can solve the problem of affecting the grinding accuracy, the service life of the grinding pad 2, the large difference in the grinding area, and the inability to achieve the uniformity of the groove area ratio And other issues

Inactive Publication Date: 2008-03-12
SAN FANG CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the polishing pad 2 is that the difference in the polishing area of ​​its local area is too large, and it is almost impossible to achieve the uniformity of the groove area ratio.
In addition, the impurities generated during the grinding process are not easy to leave the grinding pad 2 quickly, thus affecting the grinding accuracy and the service life of the grinding pad 2

Method used

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  • Grinding pad with hollow fiber and manufacturing method thereof
  • Grinding pad with hollow fiber and manufacturing method thereof
  • Grinding pad with hollow fiber and manufacturing method thereof

Examples

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Embodiment Construction

[0014] The invention provides a polishing pad with hollow fibers, which is used in chemical mechanical polishing (CMP) process to grind or polish a component to be polished. The components to be polished include but not limited to semiconductors, storage media substrates, integrated circuits, LCD flat glass, optical glass, and optoelectronic panels.

[0015] Referring to FIG. 3 , it shows a schematic cross-sectional view of a polishing pad with hollow fibers according to the present invention. The polishing pad 3 includes a body 31 and a plurality of hollow fibers 32 . The body 31 has a grinding surface 33 . In this embodiment, the main body 31 is made of high solid PU, and has a plurality of continuous or discontinuous holes 34 inside. However, it can be understood that the material of the body 31 may also be acrylic resin or other resins.

[0016] Referring to FIG. 4 , there is shown a SEM photograph of the hollow fiber used in the present invention. The hollow fibers use...

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Abstract

The present invention relates to a grinding pad with hollowing fibers and a production method thereof. The grinding pad includes a body which has a grinding surface and more than one hollow fiber. The hollow fibers are positioned in the body and have an opening in the grinding surface. The hollow area of the section of each hollow fiber is bigger than the section area of the grinding particle of the grinding slurry. Thereby the grinding slurry and particles can circulate on the grinding pad by the hollow fibers.

Description

technical field [0001] The invention relates to a chemical mechanical polishing (CMP) polishing pad and a manufacturing method thereof, in particular to a polishing pad with hollow fibers and a manufacturing method thereof. Background technique [0002] Polishing generally refers to the abrasion control of initially rough surface in the chemical mechanical polishing (CMP) process, which utilizes the abrasive slurry containing abrasive particles to be evenly dispersed on the upper surface of a polishing pad, and at the same time, a component to be polished is held against the abrasive Rub in repeated regular movements after pad. The components to be polished are objects such as semiconductors, storage medium substrates, integrated circuits, LCD flat glass, optical glass, and optoelectronic panels. In order to maintain the distribution and flow of the polishing slurry, as well as the planarization and polishing efficiency after chemical mechanical polishing, the upper surface...

Claims

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Application Information

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IPC IPC(8): B24D17/00B24B29/02H01L21/304B24D18/00B24D99/00
Inventor 冯崇智姚伊蓬蔡超元
Owner SAN FANG CHEM IND