Method and special fixture for compensating UV gum in Mobile telephone CCD camera assembling process

Abstract

The present invention discloses a method and a special clamping fixture for UV glue repair in the process of mobile phone camera assembling. Wherein, the method includes steps below: (1) Spreading UV glue between a lens base and a flexible printed circuit board; (2) Vertically arranging products with finished UV glue and keeping the flexible printed circuit board downward; (3) Taking a group of products processed in step (2) into a UV machine for UV solidification. In addition, the clamping fixture comprises a group of arranging boards to conveniently fix and withdraw product fastening pieces. After UV glues are spread between the lens base and the flexible printed circuit board, the method of the present invention vertically arranges products with finished UV glue and keeps the flexible printed circuit board downwards. Thus, gravity of the glue is utilized to balance glue penetration, thus reducing loss due to UV glue penetration and quantity of products returned for reworking.

Description

technical field [0001] The invention relates to mobile phone camera assembly technology, more specifically to a method for replenishing UV glue in the mobile phone camera assembly process and a special fixture. Background technique [0002] Usually, in the COB packaging process of the mobile phone camera, the flexible printed circuit board FPC is connected with the printed circuit board PCB by thermal pressing (as shown in Figure 1 of the accompanying drawing). Since the range of hot pressing is limited to the gold finger, there is a gap in the middle of the FPC. Therefore, in order to increase the connection strength between the FPC and the PCB, it is necessary to use glue between the lens base Holder and the FPC. Usually we use UV glue (this kind of glue) Under the irradiation of ultraviolet light (UV light), it will cure or harden, referred to as UV glue). However, due to the gap between the FPC and the PCB, the UV glue can easily penetrate into the gap through capillary...

AI Technical Summary

Problems solved by technology

However, due to the gap between the FPC and the PCB, the UV glue can easily penetrate into the gap through capillary action before curing. After a period of time and then pass through the UV machine, it can be found that most of the UV glue has completely penetrated into the gap. , so that it cannot be cured by UV light

On the other hand, for those factories that cannot use fully automatic equipment, considering labor efficiency, a certain number of products are generally divided into one unit, that is, a Lot (lot's Chinese interpretation is "a pile", that is, a certain amount of It is the meaning of a unit) to operate, so the products that have finished UV glue cannot be sent to the UV machine for curing in a short time, and some UV glue will inevitably be too small.

If the amount of UV glue is too small, it is necessary to rework and refill the glue

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