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A mould release method and machine for glue injection of semiconductor part chip

A demoulding mechanism and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as chip breakage, breakage, and high bottom of the chip, so as to reduce the chip breakage rate, ensure integrity, and eliminate chip breakage Effect

Active Publication Date: 2008-03-26
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the research process of the present invention, we found that the reason why the traditional demoulding method is easy to cause chip damage when the semiconductor element chip is demolded is mainly because the traditional demoulding method is to directly blow the compressed air for demoulding to the bottom of the chip. Or pull out the chip from the glue-filling mold by means of vacuum adsorption, which will cause the force on the chip to be concentrated in the central part, while the support point is close to the edge of the chip, so it is easy to cause local stress at the bottom of the chip to be too high and cause The phenomenon of damage, so in order to change this situation, it is necessary to improve the force condition of the chip when it is demolded

Method used

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  • A mould release method and machine for glue injection of semiconductor part chip
  • A mould release method and machine for glue injection of semiconductor part chip

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Experimental program
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Effect test

Embodiment 1

[0019] As shown in Fig. 3, a kind of method for demoulding of semiconductor element chip table surface glue filling treatment, described demoulding stress dispersing mechanism is a kind of chip surface stress dispersing mechanism 4, chip surface stress dispersing mechanism 4 is arranged on the chip 5 and the demoulding Between the mold compressed air inlet 8, the demoulding compressed air is associated with the chip through the chip surface stress dispersing mechanism, that is, the chip is demolded under the push of the chip surface stress dispersing mechanism. Described chip surface stress dispersing mechanism 4 is a software support ring 6, and software support ring 6 is made by fluororesin (FR) class engineering plastics (such as polytetrafluoroethylene), and software support ring 6 is arranged on the top of tabletop glue-filling mold 1 The middle part of the core 7 of the upper mold 2 and the lower mold 3, below the chip 5, above the demoulding compressed air inlet 8, and i...

Embodiment 2

[0021] The structure of the second embodiment is basically the same as that of the first embodiment, except that the material of the soft supporting ring is different. The material of the soft support ring is nylon (PA) type engineering plastics, such as nylon 66, PPA, PA6T and the like.

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Abstract

This invention relates to a demolding method after a semiconductor chip is filled with glue and a device unit, which sets soft bracket loops concentric with the chip in the upper and lower mold cores of a die filled with glue on a table to push the chip to be demolded under the drive of compressed air, in which, the demolding device is set with a demolding stress dispersion unit in the glue-filled die of the semiconductor chip, which is a dispersion unit of chip surface set between the chip and the demolding compressed air associating with the chip by the chip surface dispersion unit to be demolded by the push of the dispersion unit.

Description

technical field [0001] The invention relates to a processing method and mechanism of a semiconductor device, in particular to a demoulding method and mechanism of a chip of a power electronic thyristor device after glue filling. The technology of the present invention is mainly used for high-power thyristor devices. In the chip potting process, it can also be used for chip potting of other semiconductor components. It belongs to the technical field of power electronic semiconductor manufacturing. Background technique [0002] On the chip surface of many semiconductor devices, there is a circle of mesa on the outside, which needs to be treated with mesa glue during processing. In the traditional high-power thyristor and diode chip processing, the surface glue filling process is completed by one machine. However, the demoulding method of the original machine glue filling has defects, and it is easy to cause chip damage during demoulding. Therefore, in the mesa potting proce...

Claims

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Application Information

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IPC IPC(8): H01L21/56B29C39/36B29C33/44B29C33/40
Inventor 张明李继鲁蒋谊陈芳林
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD