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A tin furnace kettle mouth

A pot mouth and tin furnace technology, applied in the direction of assembling printed circuits with electrical components, can solve problems such as being unsuitable for large-scale batch processing, low work efficiency, and easy to form virtual welding of contacts.

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • A tin furnace kettle mouth

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Embodiment Construction

[0022] A tin furnace spout as shown in Figure 1 is set above the tin bath and guides the tin liquid 4 to generate tin waves at the tin outlet for soldering operations. There is at least one around the tin outlet of the pot mouth 1 The tin overflow hole 2 in the shape of a rectangular notch has a depth H of 2-8mm.

[0023] When in use, place the PCBA board 3 at a predetermined position above the spout 1, and keep a certain distance between the plane of the board and the tin outlet of the spout 1, generally controlled at 2-6mm. The shape of the spout 1 can be determined according to the distribution of the welding parts of the PCBA board 3 , and the spout 1 is usually designed as a rectangle with a width of 8-10 mm. For irregular concentrated distribution of welding parts, multiple rectangular spouts 1 can be used to form the required welding shape. The tin liquid 4 first keeps a certain liquid level in the pot mouth 1 and stores it for 1 to 3 minutes, and preheats the upper PC...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice, which is arranged above a tin groove and used for leading tin liquid to a tin outlet to generate tin wave for soldering tin, at least one tin overflow outlet is positioned around the kettle orifice tin outlet, the tin overflow outlet is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can improve the soldering efficiency, is suitable for mass automatic production, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] As we all know, soldering technology has gone through several stages such as manual soldering, dip soldering, wave soldering, reflow soldering, crimp-free soldering, perforated reflow soldering, selective point-to-point wave soldering, etc. The birth of each soldering technology is undoubtedly to adapt to different produced by the demands of the times. With the rapid development of science and technology, the innovation of production technology is also emerging one after another. However, despite this, the soldering problem of mixed-assembled PCBA boards has not yet found an effective solution. This problem has become an insurmountable problem in the electronics manufacturing industry. The bottleneck has aroused great concern of the electronics manufacturing industry. Although crimping without soldering, ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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