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Cu-Ni-Si-Co-Cr based copper alloy for electronic material and method for production thereof

一种电子材料、制造方法的技术，应用在电路、电气元件、电固体器件等方向，能够解决未确认等问题，达到导电性飞跃性提高的效果

Active Publication Date: 2008-03-26
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of greatly increasing the conductivity without reducing the strength has not yet been confirmed.

Method used

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Examples

Experimental program
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Embodiment

[0057] The following are specific examples of the present invention, these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the present invention.

[0058] The copper alloy used in the examples of the present invention, as shown in Table 1, has a composition in which the contents of Ni, Co, Cr, and Si are slightly changed, and Mg, Sn, Zn, Ag, and B are appropriately added. In addition, the copper alloy used in the comparative example is a Cu-Ni-Si-Co-Cr alloy outside the parameter range of the present invention.

[0059] Copper alloys with various compositions shown in Table 1 were melted in a high-frequency melting furnace at 1100° C. or higher, and cast into ingots with a thickness of 25 mm.

[0060] In addition, in order to confirm the role of carbon in the present invention, in the inventive example, an alumina crucible was used, the melt was covered with Ar gas, and the added elements were stirred wi...

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PUM

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Abstract

The invention provides Cu-Ni-Si-Co-Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu-Ni-Si-Co-Cr copper alloy for electronic materials, containing about 0.5 - about 2.5 % by weight of Ni, about 0.5 - about 2.5 % by weight of Co, about 0.30 - about 1.2 % by weight of Si, and about 0.09 - about 0.5 % by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4 ‰¦ [Ni+Co] / Si ‰¦ about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5 ‰¦ Ni / Co ‰¦ about 2, and wherein Pc is equal to or less than about 15 / 1000 µm 2 , or Pc / P is equal to or less than about 0.3 wherein P is the number of inclusions dispersed in the alloy and having the size of 1 µm or more, and Pc is the number of inclusions, among those having the size of 1 µm or more, whose carbon concentration is 10 % or more by weight.

Description

technical field [0001] The present invention relates to a precipitation type copper alloy, in particular to a Cu-Ni-Si-Co-Cr system copper alloy suitable for various electronic parts. Background technique [0002] Copper alloys for electronic materials used in electronic components such as lead frames, connectors, plugs, terminals, relays, and switches are required to satisfy the basic characteristics of high strength and high electrical conductivity (or thermal conductivity) at the same time. In recent years, with the rapid advancement of high integration, miniaturization, and thinning of electronic components, correspondingly, the requirements for copper alloys used in electronic components have also become higher and higher. [0003] However, in general, alloys are not only copper alloys, but are also affected by heat treatment methods, etc. in addition to the constituent elements and structure of the alloy. Slightly changing the composition elements of the alloy, their a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22F1/08C22F1/00H01L23/48
CPCC22C9/06H01L2924/0002C22F1/08H01L23/49579H01L2924/00
Inventor 江良尚彦深町一彦桑垣宽
Owner JX NIPPON MINING & METALS CORP
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