Heat conductive electrical-insulation polymeric material and heat-dissipating substrate including same

Abstract

The invention relates to heat conductive electrical insulation polymers with inter-penetrating-network (IPN), which comprises high molecular material, curing agent and heat conductive filler evenly dispersing in the high molecular material. The high molecular material comprises thermoplastics and thermosetting epoxy resin, the curing agent is used for curing the thermosetting epoxy resin at a curing temperature, and the coefficient of thermal conductivity of the heat conductive electrical insulation polymers is higher than 0.5W / mK. A heat dissipation base plate containing the heat conductive electrical insulation polymers provided by the invention has a thickness less than 0.5mm and can bear a voltage higher than 1000 Volt.

Description

technical field [0001] The present invention relates to a heat-conductive insulating (heat-conductive dielectric) polymer material and a heat dissipation substrate (heat dissipation substrate) comprising the heat-conductive electrical insulating polymer material, in particular to an inter-penetrating network structure (inter-penetrating -network; IPN) thermally conductive and electrically insulating polymer material and a heat dissipation substrate comprising the thermally conductive and electrically insulating polymer material. Background technique [0002] In recent years, white light-emitting diodes (LEDs) are the most promising emerging products that attract global attention. It has the advantages of small size, low power consumption, long life and good response speed, etc., and can solve the problems that incandescent bulbs were difficult to overcome in the past. LEDs are used in markets such as display backlights, mini projectors, lighting and automotive light sources...

AI Technical Summary

Problems solved by technology

[0005] However, the conventional process has the following disadvantages due to being limited by the properties of the resin paste: (1) the conventional process must be completed within a specific time, otherwise the resin paste will solidify and cannot be applied on the metal foil , causing waste of the resin slurry; and (2) when the conventional process is carrying out the hot pressing step, part of the resin slurry will overflow outside the two metal foils 11, and the separation of solid and liquid will occur when the hot pressing temperature is reached phenomenon (separation), so that the conductive filler is unevenly distributed in the insulating and heat-conducting material layer 12, thereby affecting the heat dissipation efficiency of the heat dissipation substrate 10

In addition, there is also the problem that the resin paste is not easy to store and the flexibility of the heat dissipation substrate process is limited due to the viscous state of the resin paste (for example, heat dissipation substrates with different shapes cannot be efficiently produced)

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