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Film-forming apparatus, matching unit, and impedance control method

A film-forming device and film-forming technology, which are used in semiconductor/solid-state device manufacturing, packaging, containers, etc., can solve the problems of insufficient film-forming time, unsatisfactory film quality, and uneven film quality.

Active Publication Date: 2008-04-16
KIRIN BREWERY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the response of the impedance control is not sufficiently fast with respect to the deposition time, the ratio of the time required for the end of the control operation after a sudden change in the load impedance to the deposition time becomes large.
In this way, it is unsatisfactory due to the inhomogeneity of the film quality

Method used

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  • Film-forming apparatus, matching unit, and impedance control method
  • Film-forming apparatus, matching unit, and impedance control method
  • Film-forming apparatus, matching unit, and impedance control method

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Embodiment Construction

[0041] Hereinafter, an embodiment of the film forming apparatus of the present invention will be described in detail with reference to the drawings. The film forming apparatus of this embodiment, such as figure 1 Shown is a resin bottle coating device 1 for forming a DLC (diamond like carbon) film on the inner surface of a resin bottle 2 (such as a PET (polyethyleneterephthalate) bottle). The DLC film is an anti-permeation film for preventing oxygen and carbon dioxide gas from permeating the resin bottle 2 undesirably. Most of the resin bottles 2 are slightly permeable to oxygen and carbon dioxide gas, and the formation of a permeation prevention film is very important for maintaining the quality of beverages, medicines, and other liquids contained in the resin bottles 2 .

[0042] The resin bottle coating device 1 includes: a base 3 , an insulating plate 4 , an external electrode 5 , an exhaust pipe 6 , an internal electrode 7 , a raw material gas supply pipe 8 , a high-freq...

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Abstract

Impedance control is realized to avoid vanishment of a plasma because of a sudden variation of the load impedance which may occur immediately after a plasma is fired. A film-forming apparatus comprises a high-frequency power supply, a matching circuit, an external electrode which receives power from the high-frequency power supply through the matching circuit and produces a plasma with the power within a film-forming chamber containing a resin bottle on which a film is to be formed, and a control section for controlling the impedance of the matching circuit. The control section maintains the impedance of the matching circuit at a constant value for a first period from a first time t1 at which the high-frequency power supply starts to supply the power to the external electrode and controls the impedance of the matching circuit in response to the reflected wave power from the external electrode for a second period from a second time t2 at which the first period ends.

Description

technical field [0001] The present invention relates to a film forming device, a matching device, and a matching circuit impedance control method, in particular to a film forming device that uses plasma discharge to form a film, a matching device mounted on the film forming device, and a method for controlling the matching device A matching circuit impedance control method for matching the impedance of a circuit. Background technique [0002] One of techniques for forming a thin film at a low temperature is a plasma CVD method using plasma discharge generated by high-frequency power or microwave power. In the plasma CVD method, since chemical species related to film formation can be excited by plasma discharge, the film formation temperature can be lowered. [0003] One of the technologies essential to the plasma CVD method is impedance matching in a power system where plasma discharge occurs. Impedance matching is very important for accurate plasma ignition and for stable...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/505B65D1/00H05H1/46
CPCH05H1/24C23C16/26C23C16/52H05H1/46H05H2242/26H01J37/32183
Inventor 松田聪浅原裕司山越英男后藤征司
Owner KIRIN BREWERY CO LTD
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