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Reverse mount key sticker LED encapsulation structure

A technology of LED packaging and patch bonding, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing the cost and difficulty of secondary light distribution, unfavorable promotion and application, etc., to improve the light output rate and reliability, improve the Brightness characteristics, the effect of reducing occlusion

Inactive Publication Date: 2008-04-30
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the rear packaging of the above-mentioned conventional flip-chip structure LED is connected to the external packaging structure through the outer leads 205 and 206. Although the LED chip is flip-chip soldered on the silicon substrate to improve the light extraction rate, this structure is still in principle. chip, which increases the cost and difficulty of subsequent secondary light distribution, especially not conducive to market promotion and application

Method used

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  • Reverse mount key sticker LED encapsulation structure
  • Reverse mount key sticker LED encapsulation structure
  • Reverse mount key sticker LED encapsulation structure

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Embodiment Construction

[0013] As shown in the figure, the flip-chip bonded chip LED packaging structure includes a conventional LED chip 301 with a front dual-electrode structure sapphire substrate and a ceramic substrate 302, on which electrical circuits including Zener diodes are arranged. line. A cavity 303 is provided on the front of the ceramic substrate, and solder balls 304 and 305 are provided at the bottom of the cavity. The LED chip is flip-chip bonded to the bottom of the cavity by solder balls, and the cavity around the LED chip is filled with silica gel 306. A flat external electrode 307 is provided on the back surface of the ceramic substrate.

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Abstract

The invention relates to a high-power LED encapsulation structure, more particularly a flipchip bonding patch LED encapsulation structure, which includes a LED wafer with a two-electrode structure on front side and a sapphire substrate and a ceramic base plate. The ceramic base plate is arranged with electrical circuits and is arranged with a concave cavity on the front side. The bottom of the concave cavity is arranged with a solder ball. The LED wafer is welded by pressing on the bottom of the concave cavity reversely by the solder ball. The concave cavity around the LED wafer is filled with silica gel. An outer electrode is arranged on the back side of the ceramic base plate. The invention has the advantages of simple structure, good reliability, LED brightness improvement, power simplification and LED secondary application and development.

Description

technical field [0001] The invention relates to a high-power LED packaging structure, in particular to a flip-chip bonding chip LED packaging structure. Background technique [0002] LED (Light Emitting Diode) has its advantages because it shows an energy-saving effect superior to traditional light sources and can be used permanently. Using LED backlight to replace the original EL backlight and CCFL backlight of the handheld device not only makes the circuit design simpler and easier, And have higher resistance to external force. Replace the original CCFL backlight of LCD TV with LED backlight, which is not only more environmentally friendly but also more vivid and bright. Replacing white light, halogen lamps and other lighting with LED lighting is not only brighter and saves power, but also lasts longer and has a faster lighting response. [0003] The demand for solid-state lighting requires continuous improvement of the input power and luminous efficiency of LEDs. At pr...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/58H01L33/62H01L33/64
CPCH01L2224/14H01L2224/16145H01L2224/48463
Inventor 包书林胡建红
Owner JIANGSU WENRUN OPTOELECTRONICS