Semiconductor device mounting board and semiconductor package

Abstract

A semiconductor device mounting board in which high density packaging and fining can be realized in response to smaller pitches while ensuring excellent reliability of package by improving a conventional wiring board, its producing method and inspecting method, and a semiconductor package. The semiconductor device mounting board in characterized by comprising a wiring structure film consisting of an insulation layer and a wiring layer, a first electrode pattern provided on one surface of the wiring structure film such that at least the side circumference thereof touches the insulation layer but at least the lower surface thereof does not touch the insulation layer and the surface of the insulation layer provided with the first electrode pattern is coplanar with the lower surface of the first electrode pattern, a second electrode pattern formed on the surface opposite to the first electrode pattern, an insulator film provided with an opening pattern being confined in the first electrode pattern, and a metal support provided on the surface of the insulator film.

Description

[0001] This application is a divisional application of the Chinese invention patent application with application number 03812111.5 (application date: May 26, 2003; name of invention: semiconductor device mounting board, its manufacturing method, its inspection method, and semiconductor packaging). technical field [0002] The present invention relates to a semiconductor device mounting board for realizing a module with high density, high speed and high frequency by mounting various devices such as semiconductor devices at high density, its manufacturing method, its inspection method, and semiconductor packaging and / or high frequency systems. Background technique [0003] Recently, as the speed and integration of semiconductor devices increase, the number of terminals increases and the pitch decreases, package wiring boards are also desired to have higher density and finer pitch to mount these semiconductor devices thereon. Currently widely used mounting boards are, for examp...

AI Technical Summary

Problems solved by technology

However, since the external terminals are formed by etching, there is a problem that it is difficult to manufacture external terminals with a narrow pitch due to the limited control of the number of side etchings in the etching step

In addition, when the package wiring board is mounted on an external board or device, since stress concentrates on the boundary between the external terminal and the insulator film, causing a noticeable defect, sufficient package reliability cannot be obtained

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