Light emitting diode radiating module and applied display apparatus

A technology of light-emitting diodes and heat dissipation modules, applied in lighting devices, cooling/heating devices of lighting devices, indirect heat exchangers, etc., can solve problems such as poor heat dissipation mechanism, dry heat pipes, and unusable heat pipes

Inactive Publication Date: 2008-06-25
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for large-sized rear projection TVs, the effect of using a general heat pipe as the heat dissipation mechanism of the LED heat dissipation module is not good.
Although the use of general heat pipes can improve the problem of poor temperature uniformity of light-emitting diodes caused by using only heat dissipation fins, the general heat pipe still has its length (about 50 cm) limitation. Once the heat pipe length is too long (greater than 50 cm) ), the working fluid inside the heat pipe will not be able to quickly return to the water, so it is easy to cause the heat pipe to dry out (Dry out), and the heat pipe will be damaged and invalid
Therefore, generally speaking, ordinary heat pipes cannot be applied to LED backlight modules larger than 20 inches

Method used

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  • Light emitting diode radiating module and applied display apparatus
  • Light emitting diode radiating module and applied display apparatus
  • Light emitting diode radiating module and applied display apparatus

Examples

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Embodiment Construction

[0028] Embodiments of the heat dissipation module and the heat pipe thereof according to the present invention will be described below with reference to related drawings.

[0029] Please refer to FIG. 2A and FIG. 2B at the same time. FIG. 2A is a schematic diagram of an LED cooling module according to a preferred embodiment of the present invention, and FIG. 2B is a schematic side sectional view of FIG. 2A . As shown in FIG. 2A , the LED cooling module 20 according to a preferred embodiment of the present invention includes a plurality of LEDs 21 , a pulsed heat pipe 22 and a plurality of cooling fins 23 . A plurality of light emitting diodes 21 are individually arranged on the pulse heat pipe 22 , and a plurality of cooling fins 23 are also connected to the pulse heat pipe 22 . The material of the impulse heat pipe 22 includes a material with high thermal conductivity, such as aluminum, copper, titanium, molybdenum, silver, stainless steel, carbon steel or other alloys.

[0...

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Abstract

The invention relates to a display device, which comprises a casing, a displaying panel, and a plurality of light emitting diode radiating modules. The displaying panel and the casing are mutually combined, the light emitting diode radiating modules are all arranged in the casing, each light emitting diode radiating module comprises a pulse type heat pipe, a plurality of light emitting diodes, and a plurality of radiating fins, and the required light source of the displaying panel is provided by the light emitting diodes. The pulse type heat pipe has an evaporating end and an opposite condensing end, a plurality of the light emitting diodes are separately arranged on the pulse type heat pipe, and the light emitting diodes are all positioned at the evaporating end. The heat radiating fins are connected with the pulse type heat pipe, and the radiating fins are all positioned at the condensing end.

Description

technical field [0001] The present invention relates to a heat dissipation module and a display device applied thereto, in particular to a heat dissipation module applied to light-emitting diodes and a display device applied thereto. Background technique [0002] Due to the advancement of science and technology, the demand for functions of various electronic products is increasing. In addition to the continuous upgrading of the speed of desktop computers, personal products such as portable mobile electronic devices such as notebook computers, mobile phones, and palmtop computers have also become important development trend. However, as the performance of the product becomes stronger, the higher the integration of the electronic components used, the higher the calorific value. Therefore, the heat dissipation performance directly affects the reliability and service life of the electronic components. [0003] Taking Light Emitting Diode (LED) as an example of a backlight sourc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/075H01L23/34H01L23/427F21V29/00H05K7/20F21V29/51F21V29/74
CPCF28D15/0266
Inventor 郑钦铭李奕升
Owner DELTA ELECTRONICS INC
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