Inter-connecting structure between multi-layer base board and producing method
A multi-layer substrate and substrate technology, which is applied in the structural connection of printed circuits, semiconductor/solid-state device manufacturing, printed circuit components, etc., can solve problems such as limited rigid system packaging concepts, and achieve the effect of improving packaging density
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[0025] The detailed description and technical content of the present invention are described as follows in conjunction with the drawings:
[0026] Please refer to FIG. 1, which shows a cross-sectional view of an interactive connection structure between multilayer substrates according to an embodiment of the present invention. The interconnected structure between the multilayer substrates includes at least a first multilayer substrate 300, a second multilayer substrate 400, and a plurality of via holes 1, 2 and 3 formed on the first multilayer substrate 300. The first outer layer of the first multilayer substrate 300 is connected to a first chip component 100, and the first outer layer of the second multilayer substrate 400 is connected to a second chip component 200. The first chip component 100 and the second chip component 200 can be any types of chip components such as logic components, memory components, analog components, optoelectronic components, microelectromechanical comp...
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