Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure

A technology of integrated packaging and installation grooves, applied in the field of lighting, can solve the problems of poor light-emitting effect, poor air-tightness, and poor heat-dissipation effect, so as to improve LED life and stability, improve light-emitting rate, and ensure air-tightness and physical strength Effect

Inactive Publication Date: 2012-01-18
ZHEJIANG INTELED OPTOELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the technical problems of poor heat dissipation effect, light output effect and poor air tightness existing in the int

Method used

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  • Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure
  • Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure
  • Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure

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Example Embodiment

[0016] Examples:

[0017] In this embodiment, a COBLED integrated packaging structure, such as figure 1 with image 3 As shown, it includes a substrate 1 and a circuit layer 2 arranged on the surface of the substrate. The substrate is an aluminum substrate. There are five parallel strip grooves 3 arranged on the substrate. In this embodiment, the light-emitting chip 4 emits blue light. The light-emitting chips are evenly arranged at the bottom of the strip groove 3, and the light-emitting chips are connected to the circuit layer 2 on the substrate through wire bonding, such as image 3 As shown, the side wall of the strip groove is inclined, forming a reflector structure. Such as figure 2 As shown, an installation groove 6 is provided on the periphery of the strip groove. The installation groove surrounds the strip groove on three sides. There is also a ring of wall glue 5 on the periphery of the strip groove. The wall glue surrounds the strip groove and the bottom of the wall ...

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Abstract

The invention relates to an integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure, which solves the technical problems of poor radiation effect, bad emergent light effect and air tightness in the existing integrated COBLED encapsulation structure. A COBLED comprises a substrate and a circuit layer arranged on the substrate, a plurality of strip-shaped slots which are arranged in parallel are arranged on the substrate, luminous chips are evenly distributed at the bottom of the strip-shaped slots, a circle of enclosure glue is arranged at the peripheries of the strip-shaped slots, and transparent glue is filled in a region surrounded by the enclosure glue. The integrated COBLED encapsulation structure has the advantages that the luminous chips are integrated in the strip-shaped slots so as to improve the encapsulation density of the luminous chips, and the luminous chips are directly contacted with the substrate, thus having a good radiation effect; the luminous chips can conduct radiation through the substrate, and current passes through the circuit layer on the surface of the substrate, thus forming a heat-electricity separation structure and further increasing the service life and stability of an LED (light-emitting diode); and the enclosure glue is embedded in the substrate, thus ensuring the air tightness and physical strength of the encapsulation; and the side walls of the strip-shaped slots are oblique, thus improving the light extraction rate of the luminous chips.

Description

technical field [0001] The invention relates to the technical field of lighting, in particular to a COBLED integrated packaging structure with good heat dissipation, light emission and sealing effects. Background technique [0002] The existing COBLED (Chip on Board) generally arranges the light-emitting chip on the circuit layer on the surface of the substrate, and forms a potting area of ​​glue by pressing a circle of plastic compound on the periphery, or makes a lead frame on the surface of the substrate to fill the wall glue , or press a layer of glue on the substrate, make a tapered hole in the glue, arrange the LED chip in the tapered hole and seal it with glue. However, these packaging solutions also have many disadvantages. For example, the light-emitting chip is not in direct contact with the substrate, but passes through a circuit layer with extremely low thermal conductivity. The overall heat dissipation effect is very poor. Not good, the pressed plastic packagin...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/62H01L33/52
Inventor 陈华
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH
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