Combined test action group test system of micro-electric communication processing structure

A technology of joint testing action and testing system, applied in the direction of electronic circuit testing, measuring electricity, measuring device, etc., can solve the problems of increasing the complexity of the backplane and increasing the manufacturing cost of the JTAG test system, and achieve the effect of reducing the manufacturing cost

Inactive Publication Date: 2008-07-09
丛云鹏
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Problems solved by technology

Then, if JSM is implemented on the backplane, the complexity of the backplane will be increased, and a placement process will be added during pro

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  • Combined test action group test system of micro-electric communication processing structure
  • Combined test action group test system of micro-electric communication processing structure

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Embodiment Construction

[0030] The core idea of ​​the present invention is: the present invention does not need to add additional JSM, specifically through the backplane realization part, the MCH realization part and the AMC realization part of the interface signal connection, can also complete the MicroTCA test operation, that is, can realize the selected master Connect with the set slave, and gradually complete the test of the slave.

[0031] The implementation of the technical solution will be further described in detail below in conjunction with the accompanying drawings.

[0032] A MicroTCA JTAG test system, the system includes an external test unit, MCH and AMC. And the MCH / AMC can be one piece or multiple pieces. Specifically, the system completes the MicroTCA test operation by connecting the interface signals of the backplane implementation part, the MCH implementation part and the AMC implementation part.

[0033]Wherein, when the system includes multiple MCHs / AMCs, the external test unit ...

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Abstract

The invention discloses a joint test action group (JTAG) test system of a micro-telecommunication computing architecture, which comprises an external test unit, and main carrier hubs (MCH) and an advanced mezzanine card (AMC) of a micro-telecommunication computing architecture, wherein the external test unit is connected with the JTAG interfaces of the MCH and the AMC in a bus manner to serve as a main device master for testing the MCH and the AMC; the MCH serves as a master for testing the AMC or as a slave to be tested by the external test unit; and the AMC services as a slave to be tested by the current master. The invention can achieve connection between the selected master and the set slave and achieve slave test step by step without achieving JTAG switch module (JSM).

Description

technical field [0001] The invention relates to a joint test action group (JTAG, JOINT TEST ACTION GROUP) test technology, in particular to a JTAG test system of a micro telecommunication processing architecture (MicroTCA, Micro Telecommunication Computing Architecture). Background technique [0002] The JTAG protocol is an international standard test protocol, mainly used for chip internal testing. The PCI Industrial Computer Manufacturers Group (PICMG, PCI Industrial Computer Manufacturers Group) has developed a set of MicroTCA specifications, the purpose of which is to allow the Advanced Mezzanine Card (AMC, Advanced Mezzanine Card) to be directly plugged into the backplane. Due to its small size, good scalability and flexibility, and cost factors, MicroTCA is suitable for use in wireless base station side equipment. [0003] Test is a more important part of MicroTCA, and the test of MicroTCA can be realized with JTAG interface. FIG. 1 is a structural diagram of the JTA...

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Application Information

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IPC IPC(8): G01R31/28G01R31/3181
Inventor 王强胡浩
Owner 丛云鹏
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