Plating self-welding method for three-dimensional micro-electrode array

A micro-electrode array and three-dimensional electrode technology, applied in the field of micro-electrode preparation, can solve the problems of expensive and complicated welding instruments, great difficulty, and difficulty in electrical interconnection, etc.

Inactive Publication Date: 2008-08-13
FUDAN UNIV
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

However, the three-dimensional welding of microelectrode arrays by these methods is relatively difficult. For example, it is difficult to weld metal needles with a length of several centimeters and a diameter of several hundred micrometers in metal microholes with a distance of several hundred micrometers. To achieve electrical interconnection, and these traditional welding methods require specific welding equipment, some welding equipment is expensive and complicated

Method used

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  • Plating self-welding method for three-dimensional micro-electrode array
  • Plating self-welding method for three-dimensional micro-electrode array

Examples

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Embodiment Construction

[0014] Weld a microelectrode with a length of 4 mm and a diameter of 0.2 mm in the micro metal hole array of the flexible interconnection shown in Figure 4. The process flow is as follows:

[0015] (a) Fix the part with the metal microhole array in the flexible interconnection line and the microelectrode on the corresponding insulating slot, as shown in Figure 1, the microhole array in the slot corresponds to the micro metal hole in the flexible interconnection line , is a 4×8 array with a diameter of 0.25 μm;

[0016] (b) Apply a layer of silver paste at the interface of the flexible interconnection line to realize the electrical interconnection of all the micro-metal holes, and connect to the cathode of the electroplating power supply to ensure that all the micro-metal holes are electroplated at the same time; fix the slot together with the above The micro-metal hole array of the micro-electrode and the flexible interconnection is partially immersed in the copper electroplat...

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Abstract

The invention relates to a method for electroplating self-welding a three-dimensional microelectrode, belonging to the field of microelectrode preparation technology. The steps comprises: putting the microelectrode through a metal micropore, and fixing on a slot; and electroplating the metal micropore to lessen the metal micropore, until the metal micropore and the microelectrode being combined together, so that self-welding of metal micropore and the microelectrode is realized. The welding method can easily realize three-dimensional welding of metal microelectrode array and metal micropore, the effect is good, the method is easy and has low cost.

Description

technical field [0001] The invention belongs to the technical field of microelectrode preparation, and in particular relates to a method for welding a three-dimensional microelectrode array. Background technique [0002] With the development of micro-nano technology, many micro-nano electronic devices have been researched and developed. Many of these tiny devices need to be electrically interconnected with the outside, and require micro-welding technology for wiring, for example, ultrasonic welding, pressure welding, and MicroFlex Interconnection technology. However, the three-dimensional welding of microelectrode arrays by these methods is relatively difficult. For example, it is difficult to weld metal needles with a length of several centimeters and a diameter of several hundred micrometers in metal microholes with a distance of several hundred micrometers. To achieve electrical interconnection, these traditional welding methods all require specific welding instruments, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D2/00
Inventor 吕尊实周嘉高安纪新明黄宜平
Owner FUDAN UNIV
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