Packaging structure for integrated circuit chip

Abstract

The invention discloses a packaging structure for an integrated circuit chip. The packaging structure for the integrated circuit chip mainly comprises a circuit board, a chip set, a packaging body and a metal shell. The packaging structure is characterized in that: the chip set is electrically connected with the circuit board and packaged by sealing glue; the packaging body is divided to an internal layer and an external layer; two layers are formed by the different packaging processes and materials; the internal-layer packaging body is adhered to the chip group and formed by a thermally spraying process; the external-layer package body is attached outside the internal-layer package body and made of mixed silicon gel material; and the metal shell is attached outside the package body and electrically connected with the circuit board. In the invention, the packaging structure for the integrated circuit chip is disclosed; the special material and the structure of the packaging body of the packaging structure be used for effectively shielding electromagnetic waves produced by the internal chip and reducing the harm of the electromagnetic waves; and therefore, the common metal shell with a high performance in the market is replaced, the packaging cost is reduced, the process is simply and conveniently implemented and the market prospect is wide.

Description

technical field [0001] The invention relates to a packaging structure of a chip, in particular to a packaging structure of an integrated circuit chip capable of effectively shielding electromagnetic wave radiation and having excellent packaging performance, and belongs to the technical field of chip packaging. Background technique [0002] In the manufacture of integrated circuits, chips are obtained through the steps of wafer fabrication, forming integrated circuits, and cutting wafers. After the integrated circuit of the wafer is fabricated, the chip formed by dicing the wafer can be electrically connected to the carrier outwardly; wherein, the carrier can be a lead frame or a substrate, and the chip can be wire bonded or covered. The method of crystal bonding is electrically connected to the carrier. If the chip and the carrier are electrically connected by wire bonding, then enter into the manufacturing step of filling the encapsulant to form the chip package. Chip pac...

AI Technical Summary

Problems solved by technology

The high-frequency chip will release a certain amount of electromagnetic waves during operation, and the electromagnetic waves will be released to the outside through the package, which will easily cause electromagnetic wave interference of peripheral electronic products and affect the normal operation of other electronic products

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