Heat pipe radiator
A heat pipe radiator and heat pipe technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve problems such as increased manufacturing costs and time costs, limited work efficiency, and reduced thermal conductivity , to achieve the effect of reducing the steps of welding and copper reduction, reducing manufacturing time and material cost, and reducing the gradient of thermal conductivity
Inactive Publication Date: 2008-08-13
GOLDEN SUN NEWS TECHN
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Problems solved by technology
Therefore, it is necessary to increase the manufacturing process to restore its color, thereby increasing the manufacturing cost and time cost
In addition, the decrease in thermal conductivity caused by the thermal resistance caused by solder is also a problem that cannot be underestimated.
Finally, since the thermal conductivity of the heat pipe is much greater than that of the heat conduction block, the heat pipe is not directly attached to the object to be dissipated.
Therefore, the working efficiency is limited, so that the improvement of thermal conductivity is limited
Method used
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[0036] The present invention will be described in detail below in conjunction with the accompanying drawings, but the accompanying drawings are only provided for reference and description, and are not intended to limit the present invention.
[0037] The present invention provides a heat pipe radiator, wherein a perspective view of the radiator is shown in FIG. 1 . Please refer to this figure, the heat sink is formed by stacking a plurality of fins 2 on the heat conducting block 1 at intervals. Wherein, the heat conducting block 1 and the fins 2 are made of aluminum, copper or other materials with high thermal conductivity. Meanwhile, the fins 2 are provided with a plurality of through holes 21 corresponding to the heat pipes 3 .
[0038] It can be seen from FIG. 1 that the heat pipe 3 is a U-shaped hollow pipe. However, those skilled in the art should understand that the heat pipe 3 may also have other shapes without departing from the scope of the present invention. There...
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A heat pipe radiator comprises heat pipe and heat conductive block, wherein the heat conductive block is formed by a clasp of an upper cover having at least one projection with a base having at least one placing groove, and the upper cover and the base engage with each other. The placing groove and the projection corresponding to the heat pipe endothermic end which is fixed in the interior of the heat conductive block by the clasp of the upper cover and the base that has a bottom surface leveled by a level processing method.
Description
[0001] This application is a divisional application of the No. 200510134532.5 application entitled "Heat Pipe Radiator" submitted to the Chinese Patent Office on December 8, 2005. technical field [0002] The invention relates to a radiator, in particular to a heat pipe radiator in which the heat pipe can directly contact the heat source. Background technique [0003] Heat is generated when electrical or electronic products such as a personal computer's CPU, laser diodes, or power transistors are used. In recent years, the heat energy generated by electronic components has been increasing day by day, and heat dissipation technology has thus become a key technology in the electrical or electronic industry. There are two typical cooling methods for electronic or electrical products. One is to directly install a cooling body on the electronic heating component, and the other is to use a fan to reduce the temperature of the housing loaded with electronic components. [0004] Th...
Claims
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IPC IPC(8): F28D15/02H05K7/20
Inventor 郑志鸿
Owner GOLDEN SUN NEWS TECHN