Heat pipe radiator and mfg. method
A technology for heat pipe radiators and manufacturing methods, applied in indirect heat exchangers, cooling/ventilation/heating renovation, lighting and heating equipment, etc., can solve the problems of increased material costs, limited work efficiency, and no direct attachment of heat pipes
Inactive Publication Date: 2007-06-13
GOLDEN SUN NEWS TECHN
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Problems solved by technology
[0007] However, the known heat pipe radiator must use the solder layer as the medium connecting the heat pipe and the heat conduction block, thus increasing the material cost
In addition, the welding of the heat pipe and the heat conduction block needs to be heated and melted to oxidize the surface of the copper heat pipe to form black copper oxide. Therefore, it is necessary to increase the manufacturing process to restore its color, thereby increasing the manufacturing cost and time cost.
In addition, the decrease in thermal conductivity caused by the thermal resistance caused by solder is also a problem that cannot be underestimated.
Finally, since the thermal conductivity of the heat pipe is much greater than that of the heat conduction block, but the heat pipe is not directly attached to the object to be dissipated, the working efficiency is limited, which makes the improvement of heat conduction efficiency limited.
Method used
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[0030] In order for those skilled in the art to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. The accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.
[0031] The present invention provides a method for manufacturing a heat pipe radiator, wherein a perspective view of the radiator is shown in FIG. 1 . Please refer to this figure, the heat sink is formed by stacking a plurality of fins 2 at intervals on the heat conduction block 1 , wherein the heat conduction block 1 and the fins 2 are made of aluminum, copper or other materials with high thermal conductivity. Meanwhile, the fins 2 are provided with a plurality of through holes 21 corresponding to the heat pipes 3 .
[0032] It can be seen from FIG. 1 that the heat pipe 3 is a U-shaped hollow pipe. However, those skilled...
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The invention relates to a manufacture method for jointing heat pipe and radiator that needs not third party medium. It is formed by embedding U shaped heat pipe in heat conductive block. The block is formed by rectangular plate and a upper cover. Containing flutes corresponding to heat absorbing end of heat pipe is set on base, and through holes corresponding to condensing end of heat pipe are set on upper cover. The heat absorbing end and the bottom of heat conductive block would be processed to plane.
Description
technical field [0001] The invention relates to a radiator and a manufacturing method thereof, in particular to a heat pipe radiator in which a heat pipe can directly contact a heat source and a manufacturing method thereof. Background technique [0002] When using electrical or electronic products such as the CPU of a personal computer, laser light emitting diodes or power transistors, heat energy is generated. In recent years, the heat energy generated by electronic components has been increasing day by day, and heat dissipation technology has thus become a key technology in the electrical or electronic industry. There are two typical cooling methods for electronic or electrical products, one is to directly install a cooling body on the electronic heating component, and the other is to use a fan to reduce the temperature of the housing loaded with electronic components. [0003] The cooling body installed on the electronic component is usually a flat base made of a materi...
Claims
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Inventor 郑志鸿
Owner GOLDEN SUN NEWS TECHN