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Flip chip encapsulation structure and carrier thereof

A technology of flip-chip packaging and carrier, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor gold-tin bonding, and achieve the effect of improving product yield

Active Publication Date: 2011-07-06
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a flip-chip packaging structure and its carrier to solve the problem of poor gold-tin bonding in the known technology due to the position of the solder bump deviated from the bump

Method used

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  • Flip chip encapsulation structure and carrier thereof
  • Flip chip encapsulation structure and carrier thereof
  • Flip chip encapsulation structure and carrier thereof

Examples

Experimental program
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Embodiment Construction

[0050] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited and described in detail with accompanying drawings as follows.

[0051] Figure 4 It is a schematic cross-sectional view of a flip-chip packaging structure according to an embodiment of the present invention. Figure 5 for Figure 4 A schematic top view of the partially patterned wire layer of the carrier of the flip-chip package structure shown in . First, please refer to Figure 4 As shown, the flip-chip packaging structure 200 of the present invention mainly includes a chip 210 , a carrier 220 and a plurality of bumps 230 . The components included in the flip-chip packaging structure 200 and the connection relationship among the components will be illustrated below with diagrams.

[0052] The chip 210 has a bonding surface 210a and a plurality of bump pads 212 disposed on the bonding surface 210a. The ca...

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PUM

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Abstract

A chip flip packaging structure comprises a chip, a loader and a plurality of bumps. The chip is provided with a joint face and a plurality of bump pads which is arranged on the joint face. The loader is arranged correspondingly to the chip, which comprises a body and a plurality of prewelding materials. The body is provided with a bearing surface for bearing the chip and a patterning conductor layer arranged on the bearing surface. The patterning conductor layer is provided with a plurality of conductors, correspondingly to the bumps, each conductor is separately provided with a graft union which stands out externally, and the linewidth of the graft union is larger than the linewidth of the conductor. The prewelding materials are arranged on the graft unions separately. The bumps are arranged between the bump pads and the corresponding prewelding materials, thus causing the chip to be connected with the loader electrically by the bumps.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure and its carrier, and in particular to a chip flip-chip packaging structure and its carrier. Background technique [0002] Flip chip bonding technology (FC for short) is a packaging technology that connects a chip (die) to a carrier (carrier). It mainly uses an area array (area array) method to connect multiple bumps The bumping pad is arranged on the active surface of the chip, and bumps are formed on the bump pad, and then the chip is flipped over, and then the bump pads on the chip surface are separated by these bumps. Electrically and structurally connected to the contact on the carrier, so that the chip can be electrically connected to the carrier through the bumps, and then electrically connected to the outside world through the internal circuit of the carrier electronic device. Since the flip-chip bonding technology (FC) can be applied to a chip package structure with a high p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/73204H01L2224/16
Inventor 陈仁川沈启智张惠珊潘彦良
Owner ADVANCED SEMICON ENG INC