Laser processing method

Abstract

The invention relates to a laser processing method, which comprises the steps that: a brittle material to be processed is provided and comprises a surface to be processed, a first surface and a second surface. The first surface and the second surface are arranged correspondingly to each other, and are respectively intersected with the surface to be processed; an incontinuous precutting line is formed on the surface to be processed and the precutting line extends along the direction starting from the first surface to the second surface; the surface to be processed is heated by a laser beam and the heating path of the laser beam is arranged in the same straight line with the incontinuous precutting line; a cooling fluid is sprayed onto the surface to be processed along the heating path of the laser beam, so as to ensure that the brittle material to be processed is completely cracked along the incontinuous precutting line. In the laser processing method, the incontinuous precutting line is formed on the brittle material to be processed by hiring the salutatory cutting, so as to selectively avoid generating lateral cracks, and further to effectively enhance the strength of the cut brittle material and the destroy load value in the four-point bending test.

Description

technical field [0001] The invention relates to a laser processing method, in particular to a laser processing method for cutting brittle materials. Background technique [0002] At present, in the field of flat panel display (FPD) manufacturing, when the brittle material to be processed, such as a glass substrate, is laser cut, a tool such as a cutter wheel or a diamond knife is pressed into the surface of the glass substrate in the whole process to cut the surface of the glass substrate. A certain depth of pre-cutting marks is generated, and then the surface of the glass substrate is heated by laser, and then the surface of the glass substrate is cooled by cooling fluid. Therefore, the stress changes on the surface of the glass substrate due to the sharply changing temperature difference make the previously generated pre-cutting marks Cracks grow downward and penetrate the entire cross-section of the glass substrate so that the glass substrate is completely separated. Whe...

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Problems solved by technology

[0004] In industrial practice, the cutting tool is used to form a continuous pre-cut line on the surface to be processed of brittle materials such as glass substrates, and the failure load value of the cut plain glass substrate measured in the four-point bending test is usually low. The average value and the maximum value are about 12.25 and 14.01 kg respectively; making the strength quality of the cut glass substrate not good

With the continuous development of glass substrate thinning technology, the glass substrate can be further thinned from the original 0.7 mm (mm) to 0.4 mm or even 0.1 mm by etching or mechanical grinding; The ratio of various cracks (such as primary microcracks and secondary microcracks) to the thickness of the glass substrate will further increase, which will highly affect the strength quality of the cut glass substrate

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