Manufacturing method of conductive blind hole on circuit substrate

Abstract

The invention discloses a production method of a conducting blind hole of a wiring base plate, which comprises the steps: firstly, the wiring base plate which comprises a first dielectric layer, a patterning line layer and a second dielectric layer is provided. The patterning line layer is clamped and positioned between the first dielectric layer and the second dielectric layer and comprises at least one capturing pad; secondly, a blind hole is formed in the second dielectric layer, wherein, the blind hole exposes the capturing pad; thirdly, an electroless copper processing is processed so as to form an electroless copper layer on the inner wall of the blind hole and the capturing pad; fourthly, the electroless copper layer on the capturing pad is removed; finally, the blind hole is filled with conducting material to form the conducting blind hole.

Description

technical field [0001] The present invention relates to a manufacturing method of a circuit substrate, and in particular to a manufacturing method of a conductive blind via of a circuit substrate. Background technique [0002] The circuit substrate is mainly composed of a plurality of patterned circuit layers and a plurality of dielectric layers stacked alternately. Among them, the patterned circuit layer is defined by copper foil layer through lithographic etching; and the dielectric layer is arranged between the patterned circuit layers to protect and isolate each patterned circuit layer; and each patterned circuit layer is passed through The conductive vias in the dielectric layer are electrically connected to each other. In addition, a plurality of contacts are formed on the surface of the circuit substrate for electrical connection with external electronic components. In the current semiconductor packaging technology, because the circuit substrate has the advantages o...

AI Technical Summary

Problems solved by technology

Therefore, the thermal expansion of the circuit substrate in use will cause the part of the electroless copper plating layer in contact with the capture pad to be easily damaged by thermal stress and peel off.

The above peeling phenomenon will cause poor contact between the conductive blind via and the patterned circuit layer, which will easily cause the conductive blind via to fail to be electrically connected to the patterned circuit layer, thereby reducing the structural reliability of the circuit substrate.

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