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Cooling encapsulation of heating element

A technology of heating elements and heat dissipation bases, which is applied to electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of reducing the effective heat dissipation area of ​​the heat dissipation base 2, and achieve the effect of improving the heat dissipation effect

Inactive Publication Date: 2010-06-09
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging colloid 5 wraps most of the upper part of the heat dissipation base, greatly reducing the effective heat dissipation area of ​​the heat dissipation base 2

Method used

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  • Cooling encapsulation of heating element
  • Cooling encapsulation of heating element
  • Cooling encapsulation of heating element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Figure 2A It is a perspective view of the heat dissipation package of the heating element using the cantilever heat conduction plate in Embodiment 1 of the present invention. The figure shows that the light emitting diode 60 is arranged on the convex seat 613, and the bottom of the convex seat 613 is connected to the heat conduction plate 610. The heat conduction plate 610 has a left heat conduction plate. Plate 611 and right heat conduction plate 612 . The conductive pins 631, 632 are arranged in the middle of the left and right heat conducting plates 611, 612, and the material of the conductive pins 631, 632 can be metal or other suitable conductive materials. The material of the heat conducting plate 610 may be metal or other suitable heat conducting materials. The surface electrodes of the light emitting diodes 60 are electrically coupled to the conductive pins 632 through the metal wires 62 . Another surface electrode is electrically coupled to the conductive pi...

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Abstract

The invention relates to a radiating encapsulation of a heating element; a conductive pin of the radiating encapsulation is arranged between heat conductive plates to form an encapsulation with a hotoutside and an electric inside; therefore, the peripheries of the heat conductive plates can lead the heat conductive plates to have better extendibility as having no restraining of electrical elements, thus lifting the radiating effect of the heating element.

Description

technical field [0001] The invention is suitable for heat dissipation packaging of heating elements, such as heat dissipation packaging of electronic components such as light emitting diodes, laser diodes, integrated circuit chips, semiconductor chips, etc. Background technique [0002] Figure 1A A perspective view of the packaging mechanism showing the known technology of "heating inside and electricity outside", Figure 1B A cross-sectional view of the packaging mechanism showing the known technology of "heat inside and electricity outside". Wherein, the LED 3 is disposed in the concave cup 222 above the heat dissipation base 2 . The conductive pins 1 extend downward from the outside of the heat dissipation base 2 to serve as the first electrode pins of the LED 3 , and another set of electrode pins 11 are arranged on the other side of the heat dissipation base 2 to serve as the second electrode pins of the LED 3 . This package shows that the conductive pins 1, 11 are di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L33/00H01S5/024H05K7/20
CPCH01L2924/0002H01L2224/48247
Inventor 林明德
Owner EPISTAR CORP