Method for soft and hard compound circuit board exerting electromagnetic shielding and system for implementing the same
An electromagnetic shielding, soft-hard composite technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of electromagnetic shielding sheet 600, such as difficulty in placement, adsorption on fingers, and difficult positioning
Inactive Publication Date: 2008-10-29
COMPEQ MFG
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Problems solved by technology
At the same time, because the electromagnetic shielding sheet 600 is very small and thin, it is easy to be adsorbed on the fingers due to static electricity, resulting in difficult positioning, so it is quite difficult to place the electromagnetic shielding sheet 600
In addition, based on this reason, when performing the pre-glue operation, one hand can only hold down the electromagnetic shielding sheet 600, and the other hand holds an electric iron to press a part of the electromagnetic shielding sheet 600, which is not only troublesome. Troublesome and prone to burns
[0014] Therefore, it can be understood that the traditional electromagnetic shielding method is not only time-consuming, but also has poor efficiency, accuracy cannot be mastered, and safety is in danger.
Method used
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[0047] figure 1A system schematic diagram showing a first preferred embodiment of the system of the present invention indicates that an automatic bonding system for electromagnetic shielding sheets includes a platform 1 and a first stamping device 2 . The first stamping equipment 2 includes a first male mold 21 , a first female mold 22 and a heating device 3 . The first master mold 22 faces the platform 1 . A first mold hole 220 runs through the first female mold 22 . A first punching bump 210 protrudes from the surface of the first male mold 21 . The punching protrusion 210 can be wedged into the first die hole 220 on the first female die 22 . The heating device 3 is disposed on the first male mold 21 for heating the first male mold 21 so that the first punching bump 210 has high heat.
[0048] It should be noted that although only one front to-be-shielded region A, one first die hole 220 , and one first die-cut bump 210 are shown in the first figure, the number thereof ...
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The invention provides a method for imposing electromagnetic shielding (EMI Shielding) on a rigid-flexible compound circuit board (Rigid-Flex PCB), and a system used for carrying out the method. The method comprises the steps that a stamping process is carried out for die-cutting out at least one electromagnetic shielding sheet from an electromagnetic shielding film, and the electromagnetic shielding sheet is hot-pressed onto a corresponding area to be shielded on the rigid-flexible compound circuit board. The system comprises a platform and a stamping device, wherein, the platform is used for placing a rigid-flexible compound circuit board; the stamping device is used for die-cutting out at least one electromagnetic shielding sheet from the electromagnetic shielding film and hot-pressing the at least one electromagnetic shielding sheet onto the corresponding area to be shielded on the rigid-flexible compound circuit board in a stamping process.
Description
technical field [0001] The present invention relates to a method and system for applying electromagnetic shielding (EMI Shielding) to a soft-hard composite circuit board, especially related to the technology of applying electromagnetic shielding by using an electromagnetic noise shielding film (electromagnetic noise shielding film). Background technique [0002] Figure 7 A rigid-flex circuit board 500 is shown. Usually, a plurality of identical rigid-flex circuit board units 50 are defined on one rigid-flex circuit board 500 . Each rigid-flex circuit board unit 50 is composed of a plurality of rigid boards 501 , 503 , 505 , 507 and a plurality of soft boards 502 , 504 , 506 . The front and back sides of the exposed parts of these flexible boards are usually the areas to be shielded that require electromagnetic shielding, such as the areas to be shielded A, B, and C on the front side of the rigid-flex circuit board 500 . Therefore, it can be understood that there are one o...
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Login to View More IPC IPC(8): H05K3/00H05K13/00
Inventor 林澄源黄德昌游埼俊
Owner COMPEQ MFG