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Regenerative method of processing fluid and reclaiming method of metals contained therein

A technology for treating liquid and recycling pipe, which is applied in the improvement of process efficiency, the manufacture of electrical components, semiconductor/solid-state devices, etc., can solve the problems that the substrate manufacturer cannot easily implement, the transportation cost is high, and the concentration is low, and it is simple and cheap. The effect of low equipment and transportation costs

Inactive Publication Date: 2008-11-12
SUMITOMO PRECISION PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] In addition, the process of separating and removing metal components from the etching solution requires corresponding equipment, so it cannot be easily carried out by substrate manufacturers.
On the other hand, in the case of implementation by waste liquid treatment personnel, etc., the used etching solution has to be transported from the substrate manufacturing personnel side to the waste liquid treatment personnel side by an oil tank truck, and the processed etching solution is transported by the oil tank truck. Waste liquid (etching liquid that can be reused) is transported from the side of the waste liquid treatment personnel to the side of the substrate manufacturing personnel, resulting in the problem of high transportation costs or insufficient efficiency
[0013] In addition, when the waste liquid treatment personnel recover the metal dissolved in the etching solution, in addition to the above-mentioned problems, since the concentration of the metal contained in the etching solution is low, it is not easy to recover the metal components in the etching solution. , leading to the very labor-intensive problem of

Method used

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  • Regenerative method of processing fluid and reclaiming method of metals contained therein
  • Regenerative method of processing fluid and reclaiming method of metals contained therein
  • Regenerative method of processing fluid and reclaiming method of metals contained therein

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no. 1 approach

[0050] First, the etching solution regeneration method according to the first embodiment of the present invention will be described based on the drawings. In this first embodiment, a method of regenerating an etching solution containing a metal component by etching a substrate will be described. In addition, FIG. 1 is an explanatory diagram for explaining the etching solution regeneration method according to the first embodiment of the present invention, figure 2 FIG. 3 is a flowchart for explaining a method for regenerating an etching solution according to the first embodiment, and FIG. 3 is an explanatory diagram showing a schematic configuration of a substrate processing apparatus and the like according to the first embodiment. Figure 4 It is an explanatory diagram showing a schematic configuration of an adsorbent regeneration apparatus and the like in the first embodiment.

[0051] First, based on Figure 1, Figure 3 and Figure 4 , the portable container 1 for adsorbing...

no. 2 approach

[0092] Next, the metal recovery method of the second embodiment of the present invention will be described based on the drawings. In the second embodiment, the substrate is etched with the etching solution, and the metal component contained in the etching solution is recovered, and this will be described. 6 is an explanatory diagram for explaining a metal recovery method according to a second embodiment of the present invention, Figure 7 It is a flowchart for demonstrating the metal recovery method of 2nd Embodiment.

[0093] Also, as shown in Figure 3 and Figure 4 and Figure 6 and Figure 7 As shown, the movable container 1 has the same structure as described above except that it can be attached to and detached from the substrate processing apparatus 10 and the metal recovery apparatus 70 for recovering the metal dissolved in the etching solution L. In addition, the metal recovery device 70 is provided with the Figure 4 The illustrated adsorbent regeneration device 40 ...

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PUM

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Abstract

The invention provides treating fluid reproducing method which is able to effectively remove the metal component contained in treating fluid for treating substrate by low cost. The method comprises: a treating fluid reproducing procedure: in the treating area for treating the substrate, the treating liquid passing through the movable container (1) filled with absorbing material inside for absorbing metallic ion; absorbing the metal component in the treating liquid in the absorbing material to separate and remove; a first transferring procedure of transferring the movable container (1) for the treating liquid to pass through to the area separated from the treating area that is absorbing material reproducing area of the reproducing absorbing material; an absorbing material reproducing procedure of in the absorbing material reproducing area, the eluant passing through the movable container (1) transferred from the treating area, eluting the metal absorbed in the absorbing material and reproducing the absorbing material; a second transferring procedure of returning the movable container (1) reproduced with absorbing material from the absorbing material reproducing area to the treating area; in the treating liquid reproducing procedure, using the movable container (1) after reproducing the absorbing material.

Description

technical field [0001] The present invention relates to a method of regenerating a processing liquid containing metal components due to substrate processing using a removable container filled with an adsorbent that adsorbs metal ions, and a method of recovering metal components contained in the processing liquid due to substrate processing. Background technique [0002] For example, in the process of manufacturing various substrates such as semiconductors, (silicon) wafers, liquid crystal glass substrates, glass substrates for photomasks, and substrates for optical disks, there are various treatments such as supplying etching liquids, developing liquids, and cleaning liquids to these substrates. A step of treating the substrate with a liquid. [0003] As an example of the treatment (etching treatment) using an etching solution, the etching treatment is carried out by an etching apparatus including a storage tank for storing the etching solution, a substrate processing mechan...

Claims

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Application Information

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IPC IPC(8): C22B3/00
CPCY02P10/20H01L21/67167
Inventor 中田胜利田中幸雄柏井俊彦
Owner SUMITOMO PRECISION PROD CO LTD
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