Steel member acidic electroplating additive for copper pre-plating and pre-plating process

An additive and process technology, applied in the field of copper plating of steel parts, can solve the problem of inability to directly plate copper, and achieve the effects of increased discharge potential, fine crystallization and good bonding

Inactive Publication Date: 2008-11-12
梁国柱 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to provide an additive and a pre-plating process for copper-plating pre-plating of iron and steel parts in an acidic solution, which solves the defect that copper cannot be directly plated in an

Method used

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  • Steel member acidic electroplating additive for copper pre-plating and pre-plating process
  • Steel member acidic electroplating additive for copper pre-plating and pre-plating process
  • Steel member acidic electroplating additive for copper pre-plating and pre-plating process

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Example Embodiment

[0043] 1. Additive formula

[0044] 1. The formulation of the main light agent: As a realization of the present invention, the weight of the raw materials (unit: grams) contained in the additive main light agent per liter of solution except for water can be as follows:

[0045] (1) Formulation 1

[0046] Fatty alcohol polyoxyethylene ether 1.0, benzotriazole 0.2, ethanol 10.0, formaldehyde 10.0, benzylidene ketone 0.2, Kinner Green B0.1, copper sulfate 2.0.

[0047] (2) Formulation 2

[0048] Alkylphenol polyoxyethylene ether 1.5, 2-mercaptobenzimidazole 0.1, methanol 10.0, vanillin 0.2, acetone 2.0, methyl violet 0.05, zinc sulfate 3.0.

[0049] (3) Formula 3

[0050] Polyethylene glycol 1.5, allyl thiourea 2.0, glycerol 3.5, piperonal 0.1, methine green 0.05, methyl orange 0.05, titanium sulfate 1.0.

[0051] (4) Formula 4

[0052] Polypropylene glycol 2.0, ethylene thiourea 1.5, methionine 2.5, ethanol 8.0, o-chlorobenzaldehyde 0.2, phenolphthalein 0.1, copper sulfate 5.0, zinc...

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Abstract

The invention relates to a copper plating process pre-plating addition agent, comprising a key light agent and an auxiliary light agent, wherein the key light agent comprises (1) a nonionic surfactant, (2) a sulfur and nitrogen containing organic compound, (3) an alcohol compound, (4) an aldehyde compound, (5) a ketone compound, (6) dyes, (7) a metallic salt and (8) water; the auxiliary light agent comprises (1) a nonionic surfactant, (2) an aldehyde compound, (3) dyes, (4) chloride, (5) a metallic salt, (6) water and (7) an inorganic acid. Preplating is a process which directly carries out copper plating in an acidic solution, thereby overcoming the disadvantage that copper plating can not be directly carried out in a steel acidic solution and realizing direct copper preplating on a steel part; moreover, the copper plating process pre-plating addition agent solves the bonding force between a copper plating layer and an iron matrix and realizes the aims of environment protection and lower cost.

Description

Technical field: [0001] The invention relates to an electroplating additive for preplating in the copper plating process of iron and steel parts and an electroplating copper preplating process for iron and steel parts, belonging to the field of copper plating of iron and steel parts. Background technique: [0002] For the acidic copper plating process of steel parts, in order to solve the defects of the bonding force of the coating in the acidic plating solution, a pre-plating process is required before copper plating. At present, the pre-plating processes used in electroplating production include cyanide copper plating process, nickel plating process and alkaline cyanide-free copper plating process. The cyanide copper plating process is widely used because of its low cost, good quality and easy operation. However, due to the highly toxic cyanide contained in the additive used, the use of this method will have a great impact on people and the environment, and the country ha...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/26
Inventor 梁国柱梁彪
Owner 梁国柱
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