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Safe and environment-friendly additive for copper plating, and preparation method of additive

A safe, environmentally friendly, additive technology, applied in the field of electroplating, can solve the problems of reducing the bonding force of the coating, cannot be directly electroplated, and has low solubility in water, etc., and achieves the effects of low cost, improved brightness, and slowed down precipitation

Active Publication Date: 2019-01-01
上海赛夫特半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sulfate copper plating is widely used in protective decorative electroplating, plastic electroplating, electroforming, printed circuit board hole metallization thickening electroplating and graphic electroplating undercoating, but it cannot be directly electroplated on zinc and iron substrates
[0004] To get a good coating, there must be a good electroplating solution, and the main role is the additive, which can improve the deep plating ability and hole wall structure of the electroplating solution, affect the crystal structure of the copper layer, and reduce the defects on the surface of the coating, but currently used Additives will reduce the binding force with other coatings; in addition, some heterocyclic compounds and dyes in the electroplating solution have low solubility in water, low use efficiency, and easy to form precipitates, resulting in uneven coatings, pitting and other defects

Method used

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  • Safe and environment-friendly additive for copper plating, and preparation method of additive
  • Safe and environment-friendly additive for copper plating, and preparation method of additive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Embodiment 1 of the present invention provides a safe and environment-friendly copper plating additive, including 5g / L aliphatic amine polyoxyethylene ether, 3g / L mercapto-containing heterocyclic compound, 13g / L polyethyleneimine alkyl compound and 1.5g / L L complexing agent;

[0071] The total amine value of the fatty amine polyoxyethylene ether is 55KOH / g, and the structure is R 1 It is a hydrocarbon group with 12 carbon atoms, n=2, m=4;

[0072] Determination of total amine value:

[0073] Instruments required for determination: Erlenmeyer flask, acid burette (25mL), analytical balance;

[0074] Reagents required for determination: glacial acetic acid, pure benzene, perchloric acid and methyl violet;

[0075] The methyl violet indicator solution that needs to be configured for the determination: 0.1% methyl violet glacial acetic acid solution;

[0076] Determination steps:

[0077] (1) Accurately weigh 0.2g sample, place it in a conical flask, add 25mL glacial ...

Embodiment 2

[0092] Example 2 of the present invention provides a safe and environment-friendly copper plating additive, the specific implementation of which is the same as in Example 1, except that it includes 8g / L fatty amine polyoxyethylene ether, 5g / L mercapto-containing heterocyclic compound, 20g / L polyethyleneimine alkyl compound and 3g / L complexing agent;

[0093] The 5-oxo-6-(mercaptomethyl)-1-thia-4-azacyclotridecane-3-carboxylic acid and 5-mercapto-4-phenyl-3H-1,2-di The weight ratio of thiolene-3-thione is 3:1;

[0094] The molar ratio of the polyethyleneimine to the halogen-containing cyclic compound is 2:1;

[0095] The weight ratio of disodium edetate to triethanolamine is 5:1.

Embodiment 3

[0097] Example 3 of the present invention provides a safe and environment-friendly copper plating additive, the specific implementation of which is the same as that of Example 1, except that it includes 2g / L aliphatic amine polyoxyethylene ether, 1g / L mercapto-containing heterocyclic compound, 5g / L polyethyleneimine alkyl compound and 0.5g / L complexing agent;

[0098] The 5-oxo-6-(mercaptomethyl)-1-thia-4-azacyclotridecane-3-carboxylic acid and 5-mercapto-4-phenyl-3H-1,2-di The weight ratio of thiolene-3-thione is 0.5:1;

[0099] The molar ratio of the polyethyleneimine to the halogen-containing cyclic compound is 0.2:1;

[0100] The weight ratio of disodium edetate to triethanolamine is 0.5:1.

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Abstract

The invention relates to the field of electroplating, in particular to a safe and environment-friendly additive for copper plating, and a preparation method of the additive. The safe and environment-friendly additive, provided by the invention, for copper plating is prepared from 2-8g / L of fatty amine polyoxyethylene ether, 1-5g / L of heterocyclic compound containing sulfhydryl, 5-20g / L of polyethylene imine alkyl compound and 0.5-3g / L of a complexing agent, wherein the total amine value of fatty amine polyoxyethylene ether is 50-60mgKOH / g, and the polyethylene imine alkyl compound contains a heterocyclic ring group.

Description

technical field [0001] The invention relates to the field of electroplating, more specifically, the invention relates to a safe and environment-friendly copper plating additive and a preparation method thereof. Background technique [0002] Electroplating is closely related to electrochemistry, organic chemistry, interface chemistry, crystallography, kinetics, etc., and is a comprehensive application technology. The main purpose of electroplating is to provide a protective layer for the surface of parts or materials or to change the surface characteristics of the base material. Electroplating is actually a metal electrodeposition process, which is the process of obtaining a metal deposition layer on a solid surface by electrolysis. [0003] The currently used copper plating processes mainly include cyanide copper plating, acid sulfate copper plating and pyrophosphate copper plating, etc., each of which has its own characteristics. Copper sulfate plating is widely used in pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 刘晓霞陈朝琦
Owner 上海赛夫特半导体材料有限公司
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