92results about How to "Increased cathodic polarization" patented technology

The invention relates to a copper plating process pre-plating addition agent, comprising a key light agent and an auxiliary light agent, wherein the key light agent comprises (1) a nonionic surfactant, (2) a sulfur and nitrogen containing organic compound, (3) an alcohol compound, (4) an aldehyde compound, (5) a ketone compound, (6) dyes, (7) a metallic salt and (8) water; the auxiliary light agent comprises (1) a nonionic surfactant, (2) an aldehyde compound, (3) dyes, (4) chloride, (5) a metallic salt, (6) water and (7) an inorganic acid. Preplating is a process which directly carries out copper plating in an acidic solution, thereby overcoming the disadvantage that copper plating can not be directly carried out in a steel acidic solution and realizing direct copper preplating on a steel part; moreover, the copper plating process pre-plating addition agent solves the bonding force between a copper plating layer and an iron matrix and realizes the aims of environment protection and lower cost.

The invention provides a surface treatment method for reducing copper powder on the rough surface of copper foil. Coarse foil formed by electroplating raw foil is treated through the first coarsening process, the second coarsening process, the first solidifying process, the second solidifying process, the galvanizing process, the oxidation prevention process, the coupling agent coating process and the drying process. Through the treatment processes, the copper powder is greatly reduced, the number of the copper powder in a 10-square-centimeter copper foil sample does not exceed 10, the maximum diameter of the copper powder does not exceed 30 microns, and therefore the risk that short circuits are caused when the copper foil is used for making printed circuit boards is greatly reduced.

The invention discloses a preparation method of nano Sn/SiC composite plating, relating to a preparation method of Sn/SiC composite plating. The invention aims to solve the problems that the existing pure tin plating is easy to grow tin whisker and has poor mechanical property and codeposition of nano particles on a cathode can not be realized easily in the conventional nano composite plating technology. The preparation method comprises the following steps: 1, soaking SiC nano particles in methanesulfonic acid, then adding dispersant, stirring, and sequentially adding tin methanesulfonate, brightening agent, codeposition accelerant and main salt stabilizer to compose a plating solution; 2, parallelizing a cathode copper foil and a pure tin anode plate into the plating solution; and 3, adjusting the cathode current density, mechanically stirring and plating alternately, and keeping stirring under compressed nitrogen all the time, thus finishing preparing the nano Sn/SiC composite plating. The prepared nano Sn/SiC composite plating is obviously improved in inhibition of tin whisker growth, corrosion resistance, hardness and the like, and the preparation method can be applied to the field of weldable plating.

The invention provides a method for preparing a solar cell Cu2S/FTO counter electrode based on the electrochemical deposition process and belongs to the technical field of solar cells. According to the method, an electrolyte is prepared firstly and then a Cu2S/FTO counter electrode is obtained in a three-electrode system through electrochemically depositing the Cu material on an FTO according to the potentiostatic method and then sulfurizing the deposited Cu material in a polysulfide solution. The above electrolyte is composed of a buffer system comprising 0.03-0.05 mol/L of CuCl2, 6.6*10<-3>-1.3*10<-2> mol/L of thiourea and 0.3-0.5 mol/L of lactic acid, and the pH value of the buffer system is 5.0-7.0. The polysulfide solution is composed of a methanol solution comprising 0.5-1 M of Na2S*9H2O, 0.5-1 M of S and 0.05-0.1 M of KCl. The method is simple in preparation process and low in cost, which provides a reliable preparation scheme for the preparation of QDSCs counter electrodes. Meanwhile, the problems of the mechanical stability and the electrolyte leakage of Cu2S/FTO counter electrodes can be solved.

The invention relates to a light rare earth base heavy rare earth alloy, a preparation technology and application thereof. The alloy contains 1-40wt% heavy rare earth, and is prepared by oxide fused salt electrolysis process in fluoride molten salt. The electrolyte is composed of rare earth fluoride, lithium fluoride and magnesium fluoride, the compositions are: 65 to 87wt% of base fluoride in rare earth fluoride, 5 to 25wt% of heavy rear earth fluoride, 5-12wt% of lithium fluoride and 0.5 to 3wt% of magnesium fluoride. Since the electric efficiency is larger than 75%, the metal recovery rate is large than 90%, the preparation technology is especially suitable for industrialized mass production.

The invention relates to alkaline cyanide-free silver plating electroplating liquid and a silver plating method. The electroplating liquid is composed of the following components including 20 g/L-50 g/L of silver nitrate, 40 g/L-100 g/L of 5,5-dimethyl hydantoin, 70 g/L-100 g/L of potassium pyrophosphate, 0.8 g/L-1.2 g/L of 3,3'-dithiobis-1-propanesulfonic acid disodium salt, 0.10 g/L-0.15 g/L of benzotriazole, 10 mg/L-15 mg/L of N,N'-bi-oleoyl-Ethylenediamine-Sodium Diethyl sulfonate, 0.10 g/L-0.30 g/L of polyethylene glycol and the balance water, wherein due to a pH adjusting agent, the pH value of the system ranges from 8 to 12. By means of the alkaline cyanide-free silver plating electroplating liquid, all the components are matched and work collaboratively, stability is good, the copper replacement resisting performance is high, and the scattering capability of the plating liquid is high; crystal grains of a silver plated layer are fine, the crystal grains are densely and neatly arranged, the surface is flat and bright, glossiness is good, and the color changing resisting capability is high; and the hardness of the plated layer is high, the combining force with a base body is high, and the alkaline cyanide-free silver plating electroplating liquid is suitable for application and popularization.

The present invention discloses a neodymium-iron-boron magnet nickel electroplating solution and a use method thereof, wherein a purpose of the present invention is to overcome defects of non-uniform thickness distribution and high porosity of the existing neodymium-iron-boron magnet nickel electroplating layer. The formula of the neodymium-iron-boron magnet nickel electroplating solution comprises 80-350 g/L of nickel sulfate, 20-80 g/L of nickel chloride, 30-55 g/L of boric acid, 0.1-5 g/L of yttrium sulfate, 0.04-2 g/L of nanometer silica, and the balance of water. According to the present invention, the nickel electroplating layer obtained by using the method has characteristics of uniform thickness distribution and lower porosity, and corrosion resistance of the neodymium-iron-boron magnet is improved.

The invention relates to the field of electroplating, in particular to a high-leveling performance acid copper brightener for copper electroplating. 1L of the high-leveling performance acid copper brightener for copper electroplating comprises the following raw materials in proportions by mass: 3-4g of a leveling agent, 1.5-2.5g of an accelerator, 7-15g of a carrier and the balance of water.

The invention relates to a tin plating electrolyte which contains a solvent and the materials with following concentration: 10-20g/L of tin methane sulfonate, 30-60g/L of methanesulfonic acid, 0.4-5g/L of compound additive, and a proper amount of PH regulator; and the compound additive is formed by thiourea, hydroquinone, 2-mercapto benzimidazole and propylene glycol block polyether. For the tin plating electrolyte, by reasonably selecting types and use amount of additives, the problems of instable plating solution and high cost in the methanesulfonic acid system are solved, and by using the tin plating electrolyte, a high-mass plating layer is acquired beneficially.

The invention discloses an ionic liquid gold plating solution containing a coordination agent and an additive and a gold plating method adopting the ionic liquid gold plating solution and belongs to the technical field of gold electroplating. The gold plating solution is prepared from a solvent [BMIm] [BF4], main salt chloroauric acid, the coordination agent and the additive. Gold electroplating mainly includes the steps of (1) a substrate pretreatment and nickel preplating process and (2) gold electroplating. The ionic liquid gold plating solution containing the coordination agent and the additive and the gold plating method adopting the ionic liquid gold plating solution have the advantages that the added coordination agent has a certain coordination relation to gold ions, the stability of a gold complex in the plating solution can be improved, cathodic polarization can be improved in the electroplating process, and the functions of refining grains and brightening plating coatings are achieved; the added additive cooperates with the coordination agent to a certain degree so that the grains can be further refined, the coatings can be more compact and the appearance can be brighter; and to sum up, the ionic liquid gold plating solution and the gold plating method have the best characteristic that by adding the coordination agent and the additive in an ionic liquid system, the stability of the gold complex in the gold plating solution and the stability of the gold plating solution are improved, and therefore the gold plating coatings and the gold plating solution which are good in properties are obtained.

The invention discloses a single tin salt electrolytic coloring additive. The single tin salt electrolytic coloring additive comprises a complexing agent, a buffer agent, an antioxidant and a surfactant, wherein the antioxidant comprises ferrous sulfate; the single tin salt electrolytic coloring additive also comprises an auxiliary agent containing ferrous sulfate; the auxiliary agent comprises modified amino amide zinc phosphate. The single tin salt electrolytic coloring additive disclosed by the invention has good comprehensive performances, solves the problem that nickel must take part in the reaction in an electrolytic coloring process, and is stable in groove liquid and quick and uniform to color, and the cost can be lowered effectively. Moreover, the single tin salt electrolytic coloring additive is low-carbon, energy-saving and green and environment-friendly, and process and product quality consistent to those of a double salt system can be obtained.

The invention discloses a method for preparing a nickel-copper alloy plating layer on the surface of carbon steel. The method specifically comprises the following steps: (1) pretreatment, wherein a carbon steel workpiece is pretreated to obtain a carbon steel base material for later use; (2) preparation of an electroplating solution, wherein nickel sulfate, copper sulfate, trisodium citrate, boric acid, an additive and a brightener are dissolved in deionized water to prepare the electroplating solution for later use, and the concentrations of nickel sulfate, copper sulfate, trisodium citrate, boric acid, the additive and the brightener in the electroplating solution are 170-200 g/L, 5-20 g/L, 60-100 g/L, 10-25 g/L, 0.05-1 g/L and 0.1-1 g/L respectively; and (3) preparation of the nickel-copper alloy plating layer, wherein the carbon steel base material is immersed into the electroplating solution, the carbon steel base material serves as a cathode, one of monel alloy, pure nickel, graphite and pure copper serves as an anode, and electroplating deposition is conducted on the carbon steel base material to form the nickel-copper alloy plating layer. The nickel-copper alloy plating layer prepared through the method not only can effectively solve the problem of corrosion of a fluorine-making electrolytic cell made of carbon steel, but also has good thermal conductivity and strong binding force with the carbon steel base material.

The invention relates to chemical oxidation treatment solution for aluminum alloy. The solution is aqueous solution formed by dissolving citrate, gluconate, tartrate, trivalent iron salt, chromite and inorganic acid in water, wherein one liter of the solution comprises 6 to 20 grams of citrate, 1 to 5 grams of gluconate, 1 to 3 grams of tartrate, 1 to 5 grams of trivalent iron salt, 3 to 5 grams of chromite and 10 to 30 grams of inorganic acid. The oxidation treatment solution has the advantages of simple preparation, low cost, relatively low control requirement on the technical conditions when used for oxidation treatment and simple and convenient operation; and an obtained oxide film layer is uniform and compact and is closely combined with a substrate. In addition, the oxidation treatment solution is used without being limited to the size and shape of a part and is suitable for surface treatment of various aluminum alloy workpieces.

The invention relates to a method for electroplating zinc in neodymium iron boron magnet ionic liquid. According to the method, a neodymium iron boron magnet treated before plating is used as a cathode, a zinc sheet is used as an anode, the ionic liquid is adopted as electroplating liquid, under the magnetic stirring condition, a power supply is conducted, the temperature, the current intensity and the electroplating time are controlled for electroplating, and then, bright dipping, passivation and aging treatment are carried out. The method is applied to the neodymium iron boron magnet electroplating, the process is simple, the price of medicine is low, the operation temperature is low, more importantly, the hydrogen evolution reaction is avoided, the obtained plating layer is bright and compact, the combination of the plating layer and a base body is firm, and the corrosion resistance performance is good.

The present invention relates to one kind of electroplating solution for preparing negative electrode of nickel-cadmium cell. The electroplating solution consists of cadmium sulfate and additives, including brightener, wetting agent and emulsifier stable under acid condition. Thus prepared negative electrode of nickel-cadmium cell has active compact cadmium coating with great binding force. The present invention also relates to the making process of negative electrode of nickel-cadmium cell with the electroplating solution. The nickel-cadmium cell with the negative electrode has high capacity, high discharge power, excellent fast charging capacity and high current efficiency.

The invention provides a nano-composite electroplating solution. The nano-composite electroplating solution is prepared from, by concentration, 23-26 g/L of cuprous cyanide, 10-12 g/L of zinc cyanide, 43-51 g/L of sodium cyanide, 25-35 g/L of sodium carbonate, 10-20 g/L of sodium potassium tartrate tetrahydrate, 4-8 g/L of ammonium chloride, 1-4 g/L of nano SiO2 and the balance water. By adding the nano SiO2, the degree of polarization of the cathode is increased, and growth of Cu-Zn alloy grains is prevented, so that a coating is more refined and compact, the porosity of a deposited layer is decreased, the particle-reinforced metal-based composite coating is formed, and accordingly the corrosion resistance of the coating is improved. It is indicated through test results that the corrosion current of the coating is greatly decreased, and it is proved that the corrosion resistance of the nano-composite coating is obviously improved compared with a Cu-Zn alloy coating. The invention further provides a preparing method of the nano-composite electroplating solution and a zinc alloy electroplated part.

The invention provides an auxiliary brightening agent for potassium chloride galvanizing. The auxiliary brightening agent is combined with a main brightening agent and a carrier brightening agent for application, and is characterized in that the formula of the auxiliary brightening agent comprises natural gum, wherein the natural gum is crushed into powder, the powder is dissolved in hot water, impurities are filtered from the powder through a filter, and the powder is added into the auxiliary brightening agent for uniform stirring. According to the auxiliary brightening agent, the cathodic polarization of a high-current density area can be improved, the dispersion capability of a plating solution can be improved, and plated layer crystals are delicate and bright; the plating solution is high in covering power, and a plated layer is clear, smooth and high in deposition speed, the binding force of the plated layer can meet requirements, high current efficiency is ensured, and a plated part is prevented from being scorched and blackened; the auxiliary brightening agent is easy to prepare, stable, low in cost, pollution-free and environmentally friendly.

The invention belongs to the technical field of radioactive source preparation, and relates to a 63Ni radioactive source and a preparation method thereof. The preparation method of the 63Ni radioactive source comprises the following steps: thoroughly cleaning the surface of a substrate, and then placing the substrate into an electroplating solution and electroplating to form a 63Ni radioactive source layer on the substrate, wherein the electroplating solution contains 63NiCl2, cerous chloride, pH value buffer agent, conducting salt and the balance water. By adopting the method for preparing the 63Ni radioactive source, the combination degree of the substrate and the radioactive source layer can be increased and the stability of the radioactive source layer can be improved; and moreover, great repeatability is further achieved, the operation difficulty in an industrial production process can be lowered, batch production is facilitated, and the need of the society on 63Ni pure beta radioactive source is met.

The invention provides a treatment device capable of reducing copper powder on a rough surface of copper foil. The device comprises a first roughing treating tank, a second roughing treating tank, a first solidifying tank, a second solidifying tank, a galvanizing tank, an oxidation resisting tank, a coupling agent coating device and a drying device. With the adoption of the device, the produced copper powder can be greatly reduced; a 10cm<2> copper foil sample contains not greater than 10 copper powder, and the diameter of the maximum copper powder does not exceed 30 microns; therefore, the risk of short circuit caused by being used for preparing a printed circuit board can be greatly reduced.

The invention discloses an additive of electrolytic acidic cupric chloride solution. The additive comprises, by weight, from 1% to 5% of polyether polyol, from 2% to 4% of amine compounds, from 1% to 3% of sulfonate and from 88% to 96% of solvents which are mixed. A catholic polarization effect of electrolytic copper can be strengthened under the action of hydroxyl in the polyether polyol, discharge of copper ions in cathodes can be suppressed, and crystallization of the cathode copper is refined; growth of crystals can be promoted under the interaction of amine functional groups in the amine compounds and the copper ions; and surface tension of the solution is reduced by the sulfonate, and the surface of the cathode copper is smooth. Accordingly, the additive of the electrolytic acidic cupric chloride solution can guarantee that the cathode copper of the electrolytic acidic cupric chloride solution is compact and smooth, and the effect of increasing the purity of the cathode copper is achieved. Besides, the additive is simple in preparation, low in cost, easy to store and suitable for industrial production and application, and is non-hazardous.