Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution

A technology of ionic liquid and complexing agent, which is applied in the field of gold plating, can solve the problems of limited ability to form complexes and has not been practically applied, and achieve the effects of bright appearance, improved cathode current efficiency, and increased stability

Inactive Publication Date: 2017-05-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These inventions all carry out electroplating after only adding gold salt in ionic liquid, and the ability of gold ion to form complex in ionic liquid is limited, and the stability of plating solution and the glossiness, flatness, compactness etc. of gold-plated layer have certain problems. problems, have not yet been applied in practice

Method used

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  • Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution
  • Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution
  • Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution

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specific Embodiment approach 1

[0023] Specific embodiment one: a kind of ionic liquid gold plating liquid that comprises complexing agent and additive, described gold plating liquid is made of solvent [BMIm] [BF 4 ], main salt chloroauric acid (HAuCl 4 ·3H 2 O), complexing agent and additives are mixed and prepared, wherein the concentration of main salt chloroauric acid is 1~50g / L, the concentration of complexing agent is 5~100g / L, and the concentration of additive is 0.5~20g / L .

[0024] Specific embodiment two: a kind of ionic liquid gold plating liquid that comprises complexing agent and additive described in specific embodiment one, described complexing agent is organic complexing agent, and described organic complexing agent is hydantoin, 3 -Hydroxymethyl-5,5-dimethylhydantoin, 5,5-diphenylhydantoin, 1,3-dichloro-5,5-dimethylhydantoin, 1- Aminohydantoin, 5,5-dimethylhydantoin, 2-thiohydantoin, 1,3-dibromo-5,5-dimethylhydantoin, 1,3- Dimethylol-5,5-dimethylhydantoin, 2-thio-5,5-dimethylhydantoin, t...

specific Embodiment approach 3

[0025] Specific embodiment three: a kind of ionic liquid gold-plating liquid that contains complexing agent and additive described in specific embodiment one or two, described additive is pyridine, 2,2-bipyridine, 4,4-bipyridine, 2- Aminopyridine, 3-aminopyridine, ethylenediamine, triethylenetetramine, tetraethylenepentamine, polyethyleneimine, triethanolamine, dopamine, polyvinyl alcohol, polyethylene glycol, adenine, guanine, hypoxanthine , cytosine, uracil, thymine, vanillin, piperonal, saccharin, uric acid, adenosine, theobromine, 3-hydroxy-2-pyridinecarboxylic acid, 2-pyridinecarboxylic acid, citric acid, ethylene glycol, methanol, butyl Alkynediol, succinimide, nicotinic acid, nicotinamide, L-methionine, imidazole, ethylenediaminetetraacetic acid, hydroxyethylethylenediaminetriacetic acid, 2-aminothiazole, thiosemicarbazide one or a mixture of several.

specific Embodiment approach 4

[0026] Specific embodiment four: a kind of method that utilizes the ionic liquid gold-plating solution that comprises complexing agent and additive described in any specific embodiment in specific embodiment one to three to carry out the method for electroplating gold, the step of the method for described electroplating gold is as follows:

[0027] Step 1: Pretreatment of the substrate and pre-nickel plating process (the pretreatment process is water washing, degreasing, pickling, and water washing in sequence, and then the pretreated substrate is placed in the nickel plating solution, and electroplated with a constant current power supply for 5~10min , to obtain a certain thickness of nickel plating layer, then wash it with distilled water and dry it with cold air);

[0028] Step 2: Electroplating gold: place the dried nickel-plated substrate in the prepared ionic liquid gold plating solution, and use a constant current method for electroplating. The process is: temperature is...

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Abstract

The invention discloses an ionic liquid gold plating solution containing a coordination agent and an additive and a gold plating method adopting the ionic liquid gold plating solution and belongs to the technical field of gold electroplating. The gold plating solution is prepared from a solvent [BMIm] [BF4], main salt chloroauric acid, the coordination agent and the additive. Gold electroplating mainly includes the steps of (1) a substrate pretreatment and nickel preplating process and (2) gold electroplating. The ionic liquid gold plating solution containing the coordination agent and the additive and the gold plating method adopting the ionic liquid gold plating solution have the advantages that the added coordination agent has a certain coordination relation to gold ions, the stability of a gold complex in the plating solution can be improved, cathodic polarization can be improved in the electroplating process, and the functions of refining grains and brightening plating coatings are achieved; the added additive cooperates with the coordination agent to a certain degree so that the grains can be further refined, the coatings can be more compact and the appearance can be brighter; and to sum up, the ionic liquid gold plating solution and the gold plating method have the best characteristic that by adding the coordination agent and the additive in an ionic liquid system, the stability of the gold complex in the gold plating solution and the stability of the gold plating solution are improved, and therefore the gold plating coatings and the gold plating solution which are good in properties are obtained.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an ionic liquid gold plating solution containing a complexing agent and additives and a gold plating method using the ionic liquid gold plating solution. Background technique [0002] As a precious metal, gold has many excellent physical and chemical properties, such as good chemical stability, excellent electrical conductivity and ductility, etc., so the gold-plated layer can be used as a decorative, protective and functional coating. Products, electronic devices, aerospace and other fields have a wide range of applications. So far, the most widely used gold plating system is still the cyanide gold plating system. The cyanide gold plating layer has the advantages of fine grain and good bonding force, but the biggest problem with cyanide is its high toxicity and great environmental and biological hazards. With the improvement of living standards and the develo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/66
CPCC25D3/665
Inventor 安茂忠宋云鹤杨培霞张锦秋冯忠宝
Owner HARBIN INST OF TECH
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