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High-leveling performance acid copper brightener for copper electroplating

A technology for filling acid copper and electroplating copper, which is applied in the field of high leveling acid copper brighteners for electroplating copper, which can solve the problems of poor dispersion of brighteners, pollute the environment, increase costs, etc., improve the properties of the coating, and increase the cathode polarization function, the effect of reducing the overpotential

Active Publication Date: 2018-01-30
WINSTAR CHEM SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, benzidine-based dyes and some azo-based dyes are not only carcinogenic, but also seriously pollute the environment
In addition, brighteners containing dye compounds have poor dispersibility and can only be used at lower temperatures. The use of such brighteners in summer requires cooling equipment, which greatly increases the cost of production

Method used

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  • High-leveling performance acid copper brightener for copper electroplating

Examples

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preparation example Construction

[0065] The preparation method of described leveling agent B at least comprises the following steps:

[0066] a. Take 5-amine-4,6-dichloropyrimidine, R 2 -NH 2 and triethylamine, where 5-amine-4,6-dichloropyrimidine, R 2 -NH 2 The molar ratio of triethylamine and triethylamine is 1:2:2, add solvent n-butanol, the molar ratio of n-butanol and 5-amine-4,6-dichloropyrimidine is 45:1, stir, heat to reflux, collect after 6h Product A, the reaction equation is shown below.

[0067]

[0068] b. Take products A and R 3 -COCl and polyphosphoric acid are dissolved in phosphorus oxychloride, wherein the products A and R 3 The molar ratio of -COCl, polyphosphoric acid and phosphorus oxychloride is 2:3:3:20. The reaction is carried out under the protection of nitrogen, stirred, heated to reflux, and the product B is collected after 12 hours. The reaction equation is shown below.

[0069]

[0070] c. Dissolve product B in dichloromethane, the molar ratio of product B to dichlorom...

Embodiment 1

[0111] Embodiment 1 provides a kind of high-filling acid copper brightener for electroplating copper, and the high-filling acid copper brightener for electroplating copper described in 1L is made up of the raw material of following mass proportion:

[0112] Leveling agent: 3g;

[0113] Accelerator: 1.5g;

[0114] Carrier: 7g;

[0115] Water was added to 1L.

[0116] The leveling agent is a mixture of leveling agent A and leveling agent B, and the mass ratio of leveling agent A and leveling agent B is 2:1. Leveling agent A is GISS (purchased from Jiangsu Mengde New Material Technology Co., Ltd.), and leveling agent B is made of monomer Aggregation is obtained, where R 1 , R 2 , R 4 Respectively H, methyl, n-butyl; R 3 For propenyl. The accelerator is ethylene thiourea and 1,3-dithioglycerol, and the molar ratio of ethylene thiourea and 1,3-dithioglycerol is 1:1. The carrier is PEG 4000.

[0117] The preparation method of described leveling agent B at least comprises ...

Embodiment 2

[0127] Embodiment 2 provides a kind of high leveling acid copper brightener for electroplating copper, 1L described copper electroplating uses high leveling acid copper brightener to be made up of the raw material of following mass proportion:

[0128] Leveling agent: 4g;

[0129] Accelerator: 2.5g;

[0130] Carrier: 15g;

[0131] Water was added to 1L.

[0132] The leveling agent is a mixture of leveling agent A and leveling agent B, and the mass ratio of leveling agent A and leveling agent B is 2:1. Leveling agent A is PVP K15 of Guangzhou Yuemei Chemical Co., Ltd., and leveling agent B is made of monomer Aggregation is obtained, where R 1 , R 2 , R 4 Respectively H, benzyl, methyl; R 3 For propenyl. The accelerator is ethylene thiourea and 1,3-dithioglycerol, and the molar ratio of ethylene thiourea and 1,3-dithioglycerol is 1:1. The carrier is PEG 4000.

[0133] The preparation method of leveling agent B is the same as embodiment 1, wherein R 1 , R 2 , R 4 Re...

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Abstract

The invention relates to the field of electroplating, in particular to a high-leveling performance acid copper brightener for copper electroplating. 1L of the high-leveling performance acid copper brightener for copper electroplating comprises the following raw materials in proportions by mass: 3-4g of a leveling agent, 1.5-2.5g of an accelerator, 7-15g of a carrier and the balance of water.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a high-filling acid copper brightener for electroplating copper. Background technique [0002] In recent years, the performance of various personal electronic devices has been greatly improved while reducing the size of the body. In order to achieve the above results and meet the market demand, the use of multilayer printed circuit board technology is one of the main aspects nowadays. [0003] By depositing metal on each through-hole or via hole, multiple different circuit layers can be connected to each other to achieve a multi-layer circuit structure, thereby increasing the effective area of ​​the printed circuit board. [0004] Therefore, the result of plated through holes will directly affect the performance of the printed circuit board. The most desirable result is a uniform copper thickness from the surface of the via to the entry area, edge or cylinder of the through via. ...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 张志恒
Owner WINSTAR CHEM SHANGHAI
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