Surface treatment method for reducing copper powder on rough surface of copper foil

A treatment method and technology of copper foil, applied in the field of surface treatment to reduce the rough surface copper powder of copper foil, can solve the problems of too many rough surface copper powder, the effect is not obvious, and can not fundamentally effectively solve the problem of rough surface copper powder and the like

Active Publication Date: 2015-09-23
ANHUI TONGGUAN COPPER FOIL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing technical solutions cannot effectively solve the problem of more copper powder on the rough surface, usually by adjusting the roughening and curing current to reduce the generation of copper powder
It can only suppress the production of

Method used

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  • Surface treatment method for reducing copper powder on rough surface of copper foil
  • Surface treatment method for reducing copper powder on rough surface of copper foil

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. The first roughening process: after the raw foil produced in the raw foil process, electroplating is performed in the roughening solution, and the current density of the first stage of the electroplating operation is 24A / dm 2 , the current density of the second stage is 5A / dm 2 , the temperature of the roughening solution is controlled at 30°C, the concentration of sulfuric acid in the roughening solution is 200g / L, Cu 2+ The concentration is 10g / L.

[0028] 2. The second roughening process: electroplate the copper foil after electroplating in the first roughening process in the roughening solution, and the current density of the first stage of the electroplating operation is 18A / dm 2 , the current density of the second stage is 4A / dm 2 , the temperature of the roughening solution is controlled at 30°C, the concentration of sulfuric acid in the roughening solution is 200g / L, Cu 2+ The concentration is 10g / L.

[0029] 3. The first curing process: electroplate the ...

Embodiment 2

[0037] 1. The first roughening process: after the raw foil produced in the raw foil process is electroplated in the roughening solution, the current density of the first stage of the electroplating operation is 30A / dm 2 , the current density of the second stage is 8A / dm 2 , the temperature of the roughening solution is controlled at 35°C, the concentration of sulfuric acid in the roughening solution is 220g / L, Cu 2+ The concentration is 14g / L.

[0038] 2. The second roughening process: electroplate the copper foil after electroplating in the first roughening process in the roughening solution, and the current density of the first stage of the electroplating operation is 20A / dm 2 , the current density of the second stage is 5A / dm 2 , the temperature of the roughening solution is controlled at 35°C, the concentration of sulfuric acid in the roughening solution is 220g / L, Cu 2+ The concentration is 14g / L.

[0039] 3. The first curing process: electroplate the copper foil afte...

Embodiment 3

[0047] 1. The first roughening process: after the raw foil produced in the raw foil process is electroplated in the roughening solution, the current density of the first stage of the electroplating operation is 35A / dm 2 , the current density of the second stage is 9A / dm 2 , the temperature of the roughening solution is controlled at 25°C, the concentration of sulfuric acid in the roughening solution is 190g / L, Cu 2+ The concentration is 12g / L.

[0048] 2. The second roughening process: electroplate the copper foil after electroplating in the first roughening process in the roughening solution, and the current density of the first stage of the electroplating operation is 25A / dm 2 , the current density of the second stage is 7A / dm 2 , the temperature of the roughening solution is controlled at 25°C, the concentration of sulfuric acid in the roughening solution is 190g / L, Cu 2+ The concentration is 12g / L.

[0049] 3. The first curing process: electroplate the copper foil afte...

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Abstract

The invention provides a surface treatment method for reducing copper powder on the rough surface of copper foil. Coarse foil formed by electroplating raw foil is treated through the first coarsening process, the second coarsening process, the first solidifying process, the second solidifying process, the galvanizing process, the oxidation prevention process, the coupling agent coating process and the drying process. Through the treatment processes, the copper powder is greatly reduced, the number of the copper powder in a 10-square-centimeter copper foil sample does not exceed 10, the maximum diameter of the copper powder does not exceed 30 microns, and therefore the risk that short circuits are caused when the copper foil is used for making printed circuit boards is greatly reduced.

Description

technical field [0001] The invention relates to a surface treatment method for reducing copper powder on the rough surface of copper foil. Background technique [0002] The copper foil produced by the existing copper foil production process, due to the loose crystal structure deposited on the matte surface during the roughening process of the surface treatment, is easy to form more copper powder, and more copper powder or copper powder diameter exceeds 50 μm. The risk of circuit short circuit in the process of making printed circuit boards is very high. When the amount of copper powder on the rough surface of the copper foil is large, the circuit will be broken down or short circuited during the post-processing of the copper foil by downstream customers, which will seriously affect the quality of the product. [0003] With the rapid development of the printed circuit board industry, the miniaturization of electronic components and the refinement of printed circuit boards, th...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D5/34C25D5/48C25D3/22
Inventor 丁士启吴玉林于君杰郑小伟贾金涛吴斌
Owner ANHUI TONGGUAN COPPER FOIL
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