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Tin plating electrolyte and preparation method and application thereof

A technology of tin plating solution and tin methanesulfonate, which is applied in the field of circuit boards, can solve problems such as tin whisker short circuit and electronic failure, adverse effects of coating corrosion resistance, unstable plating solution, etc., to improve cathodic polarization degree, improve corrosion resistance, and realize the effect of grain refinement

Active Publication Date: 2018-07-06
GUANGDONG GUANGHUA SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, electroplating tin not only needs to precisely control the thickness of the tin layer, but also ensure the accurate application of the solder layer. The spontaneous growth of tin whiskers on the surface of the coating is an important technical problem in the field of electronic electroplating. The growth of tin whiskers will cause short circuits and electronic failures. The reliability of electronic products poses a potential threat
[0004] In addition, in the existing acidic tin plating solution, the main salt is Sn 2+ The form exists, and the plating solution is easily oxidized to Sn by dissolved oxygen in the air and water during storage and electroplating. 4+ , Sn 4+ Hydrolysis forms highly dispersed tin oxide particles, leading to the formation of tin sludge. The instability of the plating solution leads to the inability to obtain a bright and dense tin coating during electroplating, which adversely affects the corrosion resistance of the coating.

Method used

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  • Tin plating electrolyte and preparation method and application thereof
  • Tin plating electrolyte and preparation method and application thereof
  • Tin plating electrolyte and preparation method and application thereof

Examples

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Embodiment 1

[0038] This embodiment provides a kind of tin plating liquid, is prepared from following raw material:

[0039] 1L of water;

[0040] Stannous methanesulfonate 13g;

[0041] Methanesulfonic acid 60g;

[0042] Thiourea 0.5g;

[0043] Hydroquinone 1g;

[0044] 2-Mercaptobenzimidazole 0.05g;

[0045] Propylene glycol block polyether 1.25g;

[0046] Sodium hydroxide 26g.

[0047] The preparation method of above-mentioned tin plating solution comprises the steps:

[0048] In 300ml of water, add thiourea, hydroquinone, 2-mercaptoimidazole and propylene glycol block polyether, stir evenly to obtain a compound additive;

[0049] Add stannous methanesulfonate and methanesulfonic acid to 700ml of water, then add the above-mentioned compound additives, stir evenly, add sodium hydroxide until the pH of the solution is 2.2, and the product is obtained.

Embodiment 2

[0051] This embodiment provides a kind of tin plating liquid, is prepared from following raw material:

[0052] 1L of water;

[0053] Stannous methanesulfonate 13g;

[0054] Methanesulfonic acid 60g;

[0055] Thiourea 0.3g;

[0056] Hydroquinone 0.5g;

[0057] 2-Mercaptobenzimidazole 0.02g;

[0058] Propylene glycol block polyether 0.6g;

[0059] Sodium hydroxide 26g.

[0060] The preparation method of the above-mentioned tin-plating solution is the same as in Example 1.

Embodiment 3

[0062] This embodiment provides a kind of tin plating liquid, is prepared from following raw material:

[0063] 1L of water;

[0064] Stannous methanesulfonate 13g;

[0065] Methanesulfonic acid 60g;

[0066] Thiourea 1g;

[0067] Hydroquinone 1.5g;

[0068] 2-Mercaptobenzimidazole 0.05g;

[0069] Propylene glycol block polyether 2g;

[0070] Sodium hydroxide 26g.

[0071] The preparation method of the above-mentioned tin-plating solution is the same as in Example 1.

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Abstract

The invention relates to a tin plating electrolyte which contains a solvent and the materials with following concentration: 10-20g / L of tin methane sulfonate, 30-60g / L of methanesulfonic acid, 0.4-5g / L of compound additive, and a proper amount of PH regulator; and the compound additive is formed by thiourea, hydroquinone, 2-mercapto benzimidazole and propylene glycol block polyether. For the tin plating electrolyte, by reasonably selecting types and use amount of additives, the problems of instable plating solution and high cost in the methanesulfonic acid system are solved, and by using the tin plating electrolyte, a high-mass plating layer is acquired beneficially.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a tin plating solution and a preparation method and application thereof. Background technique [0002] Electroplated tin-lead alloy is the earliest tin alloy discovered with great application value, and it was quickly applied to electronic components. However, with the promotion of lead-free electronic components, it is becoming more and more important to seek an alternative solderable coating. more urgent. As one of the "hardware" - gold, silver, copper, iron, tin, tin is a soft, malleable silver-white metal with excellent solderability and corrosion resistance. Pure tin plating is usually used to prevent The surface of the material is oxidized to improve corrosion resistance and weldability. Electroplated tin is mainly used in microelectronics, printed circuit board (PCB), automobile, jewelry decoration, electrochemical energy storage battery and other fields. In addition, due ...

Claims

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Application Information

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IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 王超男陆海彦李祥忠林海波肖定军
Owner GUANGDONG GUANGHUA SCI TECH
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